Evaluation of hitachi CAD to CD-SEM metrology package for OPC model tuning and product devices OPC verification

Progress in Biomedical Optics and Imaging - Proceedings of SPIE

Volumn 5752, Issue III, 2005, Pages 1341-1352

  Cantu, Pietro ^a   Capetti, Gianfranco ^a   Catarisano, Chiara ^a   D'Angelo, Fabrizio ^a   Evangelista, Elena ^a   Severgnini, Ermes ^a   Trovati, Silvia ^a   Vasconi, Mauro ^a   Sutani, Takumichi ^b   Wahl, Stephan ^c   Steffen, Robert ^c  

^a STMICROELECTRONICS   (Italy)

^b HITACHI HIGH TECHNOLOGIES CORPORATION   (Japan)

^c Hitachi High Technologies Europe GmbH   (Germany)

Author keywords

Metrology; OPC; Optical lithography; Resolution Enhancement Technology; SEM

Indexed keywords

COMPUTER SOFTWARE; ELECTRON BEAMS; MATHEMATICAL MODELS; MEASUREMENTS; OPTIMIZATION; PHOTOLITHOGRAPHY; SCANNING ELECTRON MICROSCOPY;

CRITICAL DIMENSION (CD); OPC; RESOLUTION ENHANCEMENT TECHNOLOGY; SOFTWARE PACKAGES;

COMPUTER AIDED DESIGN;

EID: 24644432976     PISSN: 16057422     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.601909     Document Type: Conference Paper

References (4)

1. Pietro Cantu et al., Evaluation of IDEALSmile for 90[nm] FLASH memory contact holes imaging with ArF scanner, Proc. of SPIE vol. 5377, 2004.
2. G. Capetti et al., Customized illumination schemes for critical layers of 90nm node dense memory devices in ArF lithography: comparison between simulation and experimental results, Proc. of SPIE vol. 5377, 2004.
3. A. Torsy et al., Detailed Process Analysis for Sub-Resolution Assist Features Introduction, Proc. of SPIE vol. 5377, 2004.
4. H. Morokuma et al., A New Matching Engine between Designed Pattern Layout and SEM Image of Semiconductor Device, Proc. of SPIE SPIE 2005