Detailed process analysis for sub-resolution assist features introduction

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5377, Issue PART 2, 2004, Pages 1172-1183

  Torsy, Andreas ^a   Toublan, Olivier ^b   Zimmermann, Rainer ^c   Smyth, Harry ^d   Hassmann, Jens ^c  

^a Altis Semiconductor   (France)

^b MENTOR GRAPHICS CORPORATION   (United States)

^c INFINEON TECHNOLOGIES AG   (Germany)

^d Mentor Graphics Corporation   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; COSTS; DEGREES OF FREEDOM (MECHANICS); DIFFRACTION; FOCUSING; MATHEMATICAL MODELS; PARAMETER ESTIMATION; TECHNOLOGICAL FORECASTING;

ELECTRICAL MEASUREMENT; OFF-AXIS ILLUMINATION (OAI); RESOLUTION ENHANCEMENT TECHNIQUES (RET); SUB-RESOLUTION ASSISTS FEATURES (SRAF);

OPTICAL RESOLVING POWER;

EID: 3843049041     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.536575     Document Type: Conference Paper

References (4)

1. Levenson, M.D. "Wavefront Engineering Techniques for Optical Photolithograhpy. Physics Today 46(7) (1993), 28.
2. Wong, A.K.K. resolution Enhancement Techniques in Optical Lithography, SPIE Press, Bellingham, WA, 2001.
3. Schellenberg, F.M. et al. "Adoption of OPC and the Impact on Design and Layout", Mentor Graphics, DAC 2001.
4. Word, J. et al. "Assist Feature OPC Implementation for the 130nm Technology Node with KrF and No Forbidden Pitches, SPIE Vol. 4691 (2002).