SCOPUS 정보 검색 플랫폼

Materials Transactions

Volumn 45, Issue 3, 2004, Pages 877-879

Agglomeration of copper thin film in Cu/Ta/Si structure

(4) Bae, Joon Woo a Lim, Jae Won a Mimura, Kouji a Isshiki, Minoru a

a TOHOKU UNIVERSITY (Japan)

Author keywords

Agglomeration; Copper; Resistivity; Thin film; Void

Indexed keywords

AGGLOMERATION; ANNEALING; COPPER; CRYSTAL MICROSTRUCTURE; ELECTRIC CONDUCTIVITY; ELECTROMIGRATION; IMAGE ANALYSIS; ION BEAM ASSISTED DEPOSITION; MORPHOLOGY; NUCLEATION; SCANNING ELECTRON MICROSCOPY; X RAY DIFFRACTION ANALYSIS;

COPPER THIN FILMS; FIELD-EMISSION SCANNING ELECTRON MICROSCOPY; VOIDS;

THIN FILMS;

EID: 2442512103 PISSN: 13459678 EISSN: None Source Type: Journal
DOI: 10.2320/matertrans.45.877 Document Type: Article

Times cited : (6)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.