Electrical property of conductive adhesives during temperature/humidity aging

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn 9, Issue , 2004, Pages 126-131

  Moon, Kyoung Sik ^a   Li, Yi ^a   Wong, C P ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CONTACT RESISTANCE; ISOTROPICALLY CONDUCTIVE ADHESIVES (ICA); SILVER FLAKES;

ADDITIVES; AGING OF MATERIALS; ATMOSPHERIC HUMIDITY; CARBON BLACK; CARBON FIBERS; DIFFERENTIAL SCANNING CALORIMETRY; ELECTRIC CONDUCTIVITY; GLASS FIBERS; SILVER; THERMAL EFFECTS;

ADHESIVES;

EID: 2442417838     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

1. J. C. Jagt, P.J.M. Beris, G.F.C.M.Lijten, "Electrically Conductive Adhesives : A Prospective Alternatives for SMD Soldering?" IEEE Trans. On CPMT, 18, 292 (1995).
2. J. Liu, Z. Lai, H. Kristiansen, C. Khoo, "Overview of conductive adhesive joining technology in electronics packaging applications", Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, 1998., pp.1, 1998.
3. K. S. Moon, C. Rockett, C. Kretz and W. F. Burgoyne and C.P. Wong, "Improvement of Adhesion and Electrical Properties of Reworkable Thermoplastic Conductive Adhesives", Journal of Adhesion Science & Technology, 17(13), 1785 (2003).
4. D. Lu; Q.K Tong, C.P. Wong, "Mechanisms underlying the unstable contact resistance of conductive adhesives" IEEE Transactions on Electronics Packaging Manufacturing, 22 (3) 228 - 232 (1999):
5. D. Lu, Q. K. Tong, C. P. Wong, "Conductivity Mechanisms of Isotropic Conductive Adhesives," IEEE Trans. on CPMT, Part C. 22, No.3, 223 (1999).
6. K.S. Moon, S. Liong, H. Li and C.P. Wong, Stabilizing Contact Resistance of Isotropically Conductive Adhesives (ICA) on Various Metal Surfaces by Incorporating Sacrificial Anode Materials, Journal of Electronic Materials, 2003, (in press).
7. H. Li, K.S. Moon, and C.P. Wong, "Novel Approach to Stabilize Contact Resistance of Electrically Conductive adhesives on Lead-Free Alloy Surfaces. Journal of Electronic Materials, 2003, (in press).
8. H. Li, K.S. Moon, C.P. Wong, "Effect of sacrificial anodic fillers on contact resistance stability of electrically conductive adhesives onto lead-free alloy surfaces", 53rd IEEE Electronic Components and Technology Conference, 2003. Proceedings, May 27-30, Page(s): 1373-1377 (2003).