Effect of sacrificial anodic fillers on contact resistance stability of electrically conductive adhesives onto lead-free alloy surfaces

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2003, Pages 1373-1377

  Li, Haiying ^a   Moon, Kyoung Sik ^a   Wong, C P ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AGING OF MATERIALS; ALLOYS; ALUMINUM; CONDUCTIVE MATERIALS; CORROSION RESISTANCE; ELECTRONICS INDUSTRY; MAGNESIUM POWDER; MATERIALS TESTING; POWDER METALS; RELIABILITY; ZINC;

ELECTRICALLY CONDUCTIVE ADHESIVES; ELECTRODE POTENTIAL; LEAD-FREE ALLOY SURFACES; SACRIFICIAL ANODIC FILLERS;

ADHESIVES;

EID: 0038350400     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

1. Gilleo, K. "Introduction to Conductive Adhesive Joining Technology," Conductive Adhesives for Electronics Packaging, J. Liu (Ed.), Electrochemical Publications (British Isles, 1999).
2. Morris, J. E. "Conduction Mechanisms and Micro-structure Development in Isotropic Electrically Conductive Adhesives," Conductive Adhesives for Electronics Packaging, Liu, J. (Ed.), Electrochemical Publications (British Isles, 1999).
3. Zwolinski, M., Hickman, J., Rubon, H., and Zaks, Y. "Electrically Conductive Adhesives for Surface Mount Solder Replacement," Proc. 2nd Intl. Conf. Adhesive Joining and Coating Technol. Electronics Manuf., Stockholm, Sweden, June 3-5, 1996, pp. 333-340.
4. Lu, D., Wong, C. P. Tong, Q. K. "Mechanisms Underlying the Unstable Contact Resistance of Conductive Adhesives," IEEE Trans-CPMT-C, Vol. 22, No. 3 (1999), pp. 228-232.
5. Lu, D., Wong, C. P., and Tong, Q., "Conductivity Mechanisms of Isotropic Conductive Adhesives," IEEE Trans-CPMT-C, Vol. 22, No. 3 (1999), pp. 223-227.
6. Jones, D.A. Principles and Prevention of Corrosion, 2nd Edition, Prentice Hall (New Jersey, 1996).
7. Takezawa, H., Mitani, T., Kitae, T., Sogo, H., Kobayashi, S. and Bessho, Y., "Effects of Zinc on the Reliability of Conductive Adhesives", 2002 8th International Advanced Packaging Materials Symposium, Stone Mountain, Georgia, USA, March 3-6, 2002, pp. 139-143.
8. Wong, C. P., Moon, K., Li, H., "Electrical conductive adhesives for lead-free surface replacement with sacrificial anti-corrosion additives," U. S. patent (pending).