Evaluation of the shape and size of 3D cracks using microwaves

NDT and E International

Volumn 38, Issue 8, 2005, Pages 726-731

  Ju, Yang ^a   Saka, Masumi ^a   Uchimura, Yasuhiro ^b  

^a TOHOKU UNIVERSITY   (Japan)

^b FURUKAWA ELECTRIC CO LTD   (Japan)

Author keywords

3D crack; Dual frequency; Evaluation; Microwave; Shape and size

Indexed keywords

CRACKS; ESTIMATION; EVALUATION; FATIGUE OF MATERIALS; MICROWAVES; SENSORS; THREE DIMENSIONAL; WAVE INTERFERENCE;

3D CRACKS; DUAL FREQUENCY; MICROWAVE INTERFERENCE EFFECTS; SHAPE AND SIZE;

MECHANICAL VARIABLES MEASUREMENT;

EID: 24344489506     PISSN: 09638695     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ndteint.2005.02.009     Document Type: Article

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