On microwave dual frequency technique for evaluation of surface cracks

Key Engineering Materials

Volumn 261-263, Issue II, 2004, Pages 955-962

  Saka, M ^a   Ju, Y ^a   Uchimura, Y ^a   Miyadu, T ^a  

^a TOHOKU UNIVERSITY   (Japan)

Author keywords

Crack; Crack Closure Stress; Crack Depth; Microwave; NDE

Indexed keywords

CRACK PROPAGATION; GRAIN BOUNDARIES; MICROWAVES; NATURAL FREQUENCIES; PRESSURIZED WATER REACTORS; STRESSES; STRUCTURAL ANALYSIS; TENSILE STRENGTH; WELDING;

CRACK CLOSURE STRESS; CRACK DEPTH; NDE;

CRACKS;

EID: 3142695490     PISSN: 10139826     EISSN: 16629795     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/kem.261-263.955     Document Type: Conference Paper

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