NDI of delamination in IC packages using millimeter-waves

IEEE Transactions on Instrumentation and Measurement

Volumn 50, Issue 4, 2001, Pages 1019-1023

  Ju, Yang ^a   Saka, Masumi ^a   Abé, Hiroyuki ^a  

^a TOHOKU UNIVERSITY   (Japan)

Author keywords

Coaxial line sensor; Delamination; IC packages; Millimeter wave imaging; Nondestructive testing

Indexed keywords

DELAMINATION; MILLIMETER WAVES; NONDESTRUCTIVE EXAMINATION; SENSORS; TOMOGRAPHY;

COAXIAL LINE SENSORS; SCANNING ACOUSTIC TOMOGRAPHY;

INTEGRATED CIRCUIT TESTING;

EID: 0035414904     PISSN: 00189456     EISSN: None     Source Type: Journal    
DOI: 10.1109/19.948319     Document Type: Conference Paper

References (9)

1. Predicting delamination in plastic IC packages and determining suitable mold compound properties
2. A fracture mechanics analysis of the effects of material properties and geometries of components on various types of package cracks
3. Millimeter-wave imaging for nondestructive evaluation of materials
4. Microwave near-field imaging with open-ended waveguide comparison with other techniques of nondestructive testing
5. Microwave imaging of thick composite with defects
6. Microwave nondestructive detection of delamination in IC packages utilizing open-ended coaxial line sensor technique
7. Nondestructive evaluation of delamination in IC package utilizing microwave technique
8. Microwave imaging for nondestructive inspection of delamination in IC packages by open-ended coaxial line sensor
9. Microwave imaging for the integrity assessment of IC package