Relationship between the propagation characteristics of via and microstrip connecting angle

Microwave and Optical Technology Letters

Volumn 38, Issue 3, 2003, Pages 225-228

  Ji, Wusheng ^a   You, Bin ^a   Wang, Xuedong ^a   Li, Ying ^a  

^a SHANGHAI UNIVERSITY   (China)

Author keywords

Microstrip connecting angle; Multilayer circuit; Propagation characteristics; Via

Indexed keywords

COMPUTER SIMULATION; ELECTROMAGNETIC WAVE PROPAGATION; FINITE DIFFERENCE METHOD; MICROSTRIP LINES; MICROWAVES; NATURAL FREQUENCIES; SCATTERING PARAMETERS; TIME DOMAIN ANALYSIS;

MICROSTRIP CONNECTING ANGLE; MULTILAYER CIRCUITS; VIA;

INTERCONNECTION NETWORKS;

EID: 0038451202     PISSN: 08952477     EISSN: None     Source Type: Journal    
DOI: 10.1002/mop.11021     Document Type: Article

References (4)

1. T.Y. Wang, R.F. Harrington, and J.R. Mautz, Quasi-static analysis of a microstrip via through a hole in a ground plane. IEEE Trans Microwave Theory Techn MTT-36 (1988), 1000-1013.
2. S.-G. Hsu and R.-B. Wu, Full wave characterization of a through hole via using the matrix-penciled moment method, IEEE Trans Microwave Theory Tech MTT-42 (1994), 1540-1547.
3. S. Maeda, T. Kashiwa, and I. Fukai, Full wave analysis of propagation characteristics of a through hole using the finite-difference time-domain method, IEEE Trans Microwave Theory Techn MTT-39 (1991), 2154-2159.
4. C.-W. Lam, S.M. Ali, and P. Nuytkens, Three-dimensional modeling of multichip module interconnects, IEEE Trans Components Hybrids Manufact Technol CHMT-16 (1993), 699-704.