LTCC microwave multichip modules

Tien Tzu Hsueh Pao/Acta Electronica Sinica

Volumn 30, Issue 5, 2002, Pages 711-714

  Yan, Wei ^a   Hong, Wei ^a   Xue, Yu ^a  

^a SOUTHEAST UNIVERSITY   (China)

Author keywords

LTCC; Microwave MCM; Vertical microwave interconnecting

Indexed keywords

CERAMIC MATERIALS; COMPUTER SIMULATION; COMPUTER SOFTWARE; ELECTROMAGNETIC FIELD THEORY; INTEGRATED CIRCUIT TESTING; OPTIMIZATION; THREE DIMENSIONAL;

LOW TEMPERATURE COFIRED CERAMICS; MICROWAVE MULTICHIP MODULES; VERTICAL INTERCONNECTING;

MONOLITHIC MICROWAVE INTEGRATED CIRCUITS;

EID: 0036586960     PISSN: 03722112     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (6)

1. Multichip MMIC package for X and Ka bands
2. High density packaging of X-band array modules
3. Characterization of Plated Via Hole Fences for Isolation Between Stripline Circuits in LTCC Packages
4. Development of a laminated waveguide