Characterization of ashing damage in depth in low-k dielectric films by micro beam IR method

Advanced Metallization Conference (AMC)

Volumn , Issue , 2004, Pages 375-380

  Seki, H ^a   Inoue, K ^a   Nagai, N ^a   Shimada, M ^b   Inukai, K ^b   Hashimoto, H ^a   Ogawa, S ^b  

^a TORAY RESEARCH CENTER INC   (Japan)

^b SEMICONDUCTOR LEADING EDGE TECHNOLOGIES INC   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CARBON; COMPOSITION; ETCHING; HYDROGEN; INFRARED RADIATION; PERMITTIVITY; RAMAN SCATTERING; SILICON;

ASHING DAMAGE; ASHING PROCESS; GRADIENT SHAVING PREPARATION (GSP); HYGROSCOPIC PROPERTIES;

DIELECTRIC FILMS;

EID: 23844491507     PISSN: 15401766     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. N. Nagai et al, Surf. Interface Anal., 34, 545 (2002).
2. K. Inukai et al, IITC Proceeding, 2003, pp. 147.
3. Hilton G.Pryce Lewis et al, J. Electrochem. Soc., 148, F212 (2001).
4. Licheng. M. Han et al, J. Electrochem. Soc., 148, F148 (2001).