Simulation model development for solder joint reliability for high performance FBGA assemblies

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn 20, Issue , 2004, Pages 300-307

  Qi, Haiyu ^a   Lee, Mikyoung ^a   Osterman, Michael ^a   Lee, Kyujin ^b   Oh, Seyong ^b   Schmidt, Tim ^c  

^a UNIVERSITY OF MARYLAND   (United States)

^b SAMSUNG Electronics   (South Korea)

^c Trilion Quality Systems   (United States)

Author keywords

Fatigue Life; FBGA; FEA; Warpage

Indexed keywords

ELECTRONIC SPECKLE PATTERN INTERFEROMETRY (ESPI); FINE PITCH PLASTIC BALL GRID ARRAY (FBGA); WARPAGE;

ARRAYS; BOUNDARY CONDITIONS; CHARGE COUPLED DEVICES; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; OPTIMIZATION; THERMAL LOAD; THERMOMECHANICAL TREATMENT;

SOLDERED JOINTS;

EID: 2342635063     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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