Thermal chip fabrication with arrays of sensors and heaters for micro-scale impingement cooling heat transfer analysis and measurements

Biosensors and Bioelectronics

Volumn 20, Issue 1, 2004, Pages 103-114

  Shen, C H ^a   Gau, C ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

MEMS fabrication; Micro impingement cooling heat transfer; Micro scale impinging jet; Thermal chip

Indexed keywords

COOLING; FLUID DYNAMICS; HEAT FLUX; HEAT TRANSFER; NUSSELT NUMBER;

SENSOR ARRAYS; THERMAL CHIP FABRICATION;

BIOSENSORS;

CONFERENCE PAPER; COOLING; ENVIRONMENTAL TEMPERATURE; FLOW MEASUREMENT; HEAT LOSS; HEAT TRANSFER; HEATING; SENSOR; THERMAL ANALYSIS;

COLD; EQUIPMENT DESIGN; EQUIPMENT FAILURE ANALYSIS; FLOW INJECTION ANALYSIS; HEAT; HEATING; MICROFLUIDIC ANALYTICAL TECHNIQUES; REPRODUCIBILITY OF RESULTS; SENSITIVITY AND SPECIFICITY; THERMAL CONDUCTIVITY; THERMOGRAPHY; TRANSDUCERS;

EID: 2342603893     PISSN: 09565663     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.bios.2003.10.014     Document Type: Conference Paper

References (11)

1. Gau C., Chung C.M. Surface curvature effect on slot air jet impingement cooling flow and heat transfer process. ASME J. Heat Transfer. 113:1991;858-864
2. Gau C., Sheu W.Y., Shen C.H. Impingement cooling flow and heat transfer under acoustic excitations. ASME J. Heat Transfer. 119:1997;810-817
3. Jambunatham K., Lai E., Moss M.A., Button B.L. A review of heat transfer data for single circular jet impingement. Int. J. Heat Fluid Flow. 13(2):1992;106-115
4. Kline S.J., McClintock F.A. Describing uncertainties in single-sample experiments. Mech. Eng. 75:1953;3-12
5. Lu N.C.C., Gerzberg L., Meindl J.D. A qualitative model of the effect of grain size on the resistivity of polycrystalline silicon resistors. IEEE Electron Device Lett. 3:1980;3. (EDL-1)
6. Martin, H., 1977. Heat and mass transfer between impinging gas jets and solid surfaces, in: Hartnett, J., Irvine Jr., T. (Eds.). Adv. Heat Transfer 13, 1-60.
7. Obsermeier E., Kopystynski P. Polysilicon as a material for microsensor applications. Sens. Actuators A. 30:1992;149-155
8. Shen, C.H., 2003. Thermal chip fabrication with arrays of sensors and heaters with analysis and measurements of micro-scale impingement cooling flow and heat transfer. Ph.D. Thesis. National Cheng Kung University, Taiwan, ROC.
9. Stefanescu, S., Mehregany, M., Leland, J., Yerkes, K., 1999. Micro-jet array heat sink for power electronics, Proc. of IEEE 12th International Workshop on MEMS, Orlando, FL, 165-170.
10. Wang, E.N., Zhang, L., Koo, J. M., Goodson, K. E., Kenny, T. W., 2002. Micromachined jet arrays for liquid impingement cooling of VLSI chips. Solid-State Sens. Actuator Microsyst. Workshop, Hilton Head, 46-49.
11. Wu, S., Mai, J., Tai, Y.C., Ho, C.M., 1999. Micro heat exchanger by using MEMS impinging jets. Proc. of IEEE 12th International Workshop on MEMS, Orlando, FL, 171-176.