Fabrication and thermal evaluation of silicon on diamond wafers

Journal of Electronic Materials

Volumn 34, Issue 7, 2005, Pages 1089-1094

  Aleksov, A ^a   Wolter, S D ^a,b   Prater, J T ^b   Sitar, Z ^a  

^a North Carolina State University   (United States)

^b U S ARMY RESEARCH OFFICE   (United States)

Author keywords

Diamond; Silicon; Silicon on insulator (SOI); Thermal

Indexed keywords

DIAMOND FILMS; DIAMONDS; ELECTRIC VARIABLES MEASUREMENT; ELECTRONIC EQUIPMENT; INTEGRATED CIRCUITS; NUCLEATION; SILICON; SINGLE CRYSTALS; THERMAL CONDUCTIVITY;

DIAMOND WAFERS; HIGHLY ORIENTED DIAMONDS (HOD); SILICON ON DIAMOND (SOD); THERMAL;

SILICON ON INSULATOR TECHNOLOGY;

EID: 23244443953     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-005-0100-y     Document Type: Article

References (19)

1. N.K. Annamalai, P. Fechner, and J. Sawyer, Proc. 1992 IEEE Int. SOI Conf. (Piscataway, NJ: IEEE, 1992), pp. 64-65.
2. A. Soderbarg, B. Edholm, J. Olsson, S. Tiensuu, and E. Johansson, Proc. 1993 IEEE Int. SOI Conf. (Piscataway, NJ: IEEE, 1993), pp. 58-59.
3. G.E. Moore, Electronics 38, 1 (1965).
4. G.G. Shahidi, IBM J. Res. Development 46, 121 (2002).
5. G.E. Moore, 2003 IEEE Int. Solid State Circuits Conf., Dig. of Technical Papers (Piscataway, NJ: IEEE, 2003), pp. 1-19.
6. M.W. Geis, Proc. IEEE (Piscataway, NJ: IEEE, 1991), vol. 79, pp. 669-675.
7. J.E. Graebner, S. Jin, G.W. Kammlott, Y.-H. Wong, J.A. Herb, and C.F. Gardinier, Diamond Related Mater. 2, 1059 (1993).
8. P.C. Karulkar and N.K. Annamalai, Proc. 1992 IEEE Int. SOI Conf. (Piscataway, NJ: IEEE, 1992), pp. 108-109.
9. N.K. Annamalai, J. Sawyer, P. Karulkar, W. Maszara, and M. Landstrass, IEEE Trans. Nucl. Sci. 40, 1780 (1993).
10. A. Soderbarg, B. Edholm, and S. Bengtsson, Proc. 1995 IEEE Int. SOI Conf. (Piscataway, NJ: IEEE, 1995), pp. 104-105.
11. B. Edholm, L. Vesting, M. Bergh, S. Tiensuu, and A. Soderbarg, Proc. 1997 IEEE Int. SOI Conf. (Piscataway, NJ: IEEE, 1997), pp. 30-31.
12. C. Gu, Z. Jin, X. Lu, G. Zou, C. Wang, J. Lu, D. Yao, X. Su, and Z. Xu, Diamond Rel. Mater. 7, 753 (1998).
13. N. Govindaraju (Ph.D. thesis, North Carolina State University, 2004).
14. H. Verhoeven, A. Floeter, A. Reiss, R. Zachai, D. Wittorf, and W. Jaeger, Appl. Phys. Lett. 71, 1329 (1997).
15. S.D. Wolter, T.H. Borst, P. Gluche, W. Ebert, A. Vescan, and E. Kohn, Appl. Phys. Lett. 68, 3558 (1996).
16. S.D. Wolter, F. Okuzumi, J.T. Prater, and Z. Sitar, Phys. Status Solidi A 186, 331 (2001).
17. B.R. Stoner, G.-H.M. Ma, S.D. Wolter, and J.T. Glass, Phys. Rev. B 45, 11067 (1992).
18. D.E. Lide, ed. CRC Handbook of Chemistry and Physics, 84th edition, CRC Press, 2000, Section 12.
19. International Technology Roadmap for Semiconductors, 2003 ed., Assembly and Packaging, http://public.itrs.net/Files/2003ITRS/Assembly2003.pdf