Comparing the costs of photoresist coating using spin, spray, and electrodeposition systems

MICRO

Volumn 23, Issue 3, 2005, Pages 45-49

  Pham, Nga P ^a   Sarro, Pasqualina M ^a,c   Bertens, Jurgen ^b   Van Den Brekel, Lucas ^b  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

^b Besi Plating ^*  (Netherlands)

^c DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

COAT WAFERS; COATING PROCESS; RESIST CONSUMPTION; SPRAY COATING;

COSTS; ELECTRIC INSULATORS; ELECTRODEPOSITION; ELECTROPLATING; PROCESS CONTROL; SPIN COATING; SPRAYING; THROUGHPUT;

COATING TECHNIQUES;

EID: 22444437600     PISSN: 10810595     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Review

References (4)

1. NP Pham et al., "Photoresist Coating Methods for the Integration of Novel 3-D RF Microstructures," IEEE Journal of MEMS 13, no. 3 (2004): 491-499.
2. C Christensen et al., "Wafer Through-Hole Interconnections with High Vertical Wiring Densities," IEEE Transactions on Components, Packaging and Manufacturing A 19, no. 4 (1996): 516-521.
3. P Haaland, J McKibben, and M. Paradi, "Fundamental Constraints on Thin Film Coatings for Flat Panel Display Manufacturing," in Proceedings of the Display Manufacturing Technology Conference (San Jose: SID, 1995), 79-81.
4. NP Pham, JN Burghartz, and PM Sarro, "A Model for Film Thickness Using Direct Spray Coating," in Proceedings of the IEEE Electronics Packaging Technology Conference (Piscat-away, NJ), 773-776.