Development of a dicing blade with photopolymerizable resins for improving machinability

CIRP Annals - Manufacturing Technology

Volumn 54, Issue 1, 2005, Pages 293-296

  Lee, S B ^a   Tani, Y ^a   Enomoto, T ^b   Sato, H ^a  

^a INSTITUTE OF INDUSTRIAL SCIENCE   (Japan)

^b OSAKA UNIVERSITY   (Japan)

Author keywords

Grinding; Machinability; Tool

Indexed keywords

ALUMINA; GRINDING (MACHINING); MACHINABILITY; PHOTOPOLYMERIZATION; RAPID PROTOTYPING; SILICON WAFERS; THERMOSETS;

DICING BLADES; GRINDING RATIO; PHOTOPOLYMERIZABLE RESINS; THERMOSET RESIN BLADE;

RESINS;

EID: 21944442632     PISSN: 00078506     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0007-8506(07)60106-1     Document Type: Article

References (6)

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3. Tani, Y., Saeki, T., Samitsu, Y., Kobayashi, K., Sato, T., 1998, Infeed Grinding of Silicon Wafers Applying Electrphoretic Deposition of Ultrafine Abrasives, Annals of the CIRP, 47/1:245-248.
4. Kruth, J. -P., Leu, M. C., Nakagawa, N., 1998, Progress in Additive Manufacturing and Rapid Prototyping, Annals of the CIRP, 47/2:525-540.
5. Komanduri, R., Lucca, D. A., Tani, Y., 1997, Technological Advances in Fine Abrasive Processes, Annals of the CIRP, 46/2:545-596.
6. Webster, J., Tricard, M., 2004, Innovations in Abrasive Products for Precision Grinding, Annals of the CIRP, 53/2:1-21.