Infeed grinding of silicon wafers applying electrophoretic deposition of ultrafine abrasives

CIRP Annals - Manufacturing Technology

Volumn 47, Issue 1, 1998, Pages

  Tani, Y ^a   Saeki, T ^a   Samitsu, Y ^b   Kobayashi, K ^b   Sato, Y ^c  

^a INSTITUTE OF INDUSTRIAL SCIENCE   (Japan)

^b Okamoto Machine Tool Works Ltd   (Japan)

^c Shin Nissan Diamond Tools Mfg CL   (Japan)

Author keywords

Mirror finish; Silicon wafer; Surface grinding

Indexed keywords

ABRASIVES; AGGLOMERATION; BRITTLENESS; DIAMOND CUTTING TOOLS; ELECTROPHORETIC COATINGS; GRINDING WHEELS; SILICON WAFERS; VISCOSITY OF LIQUIDS;

ALUMINUM BONDED DIAMOND CUTOFF WHEELS; DESICCATION; ELECTROOSMOSIS; INFEED GRINDING; MIRROR SURFACE FINISH; ULTRAFINE ABRASIVES;

GRINDING (MACHINING);

EID: 0242522372     PISSN: 00078506     EISSN: None     Source Type: Journal    
DOI: 10.1016/s0007-8506(07)62827-3     Document Type: Article

References (6)

1. Abe, T., 1989, Future Technology in Si Watering Process for VLSI, Proc. of 5th Precision Engineering Seminar, 18-22
2. Ikeno, J., Tani, Y. and Sato, H., 1990, Nanometer Grinding Using Ultrafine Abrasive Pellets, Annals of the CIRP, 39/1:341-344.
3. Ikeno, J., Tani, Y. and Sato, H., 1994, Development of Highly Homogeneous Pellets Applying Electrophoretic deposition of Ultrafine Abrasives for Nanometer Grinding, Annals of the CIRP, 43/1:319-322
4. Ikeno, J, Tani, Y. and Fukutani, A., 1991, Development of Chipping-Free Dicing Technology Applying Electrophoretic deposition of Ultrafine Abrasives, Annals of the CIRP, 40/1:351-354
5. Kurobe, T., Imanaka, O. and Sakaya, K., 1986, Electric Field-Assisted Fine Finishing Using Electrophoresis Phenomenon, J. of JSPE, 52/3:151-156.
6. Toenshoff, H.K., Schmieden, W.v., Inasaki, I, Koenig, W., and Spur, G., 1990, Abrasive Machining of Silicon, Annals of the CIRP, 39/2:621-635.