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Volumn 51, Issue 15, 2003, Pages 4611-4619
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The effect of low stresses on creep and surface profiles of thin copper wires
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Author keywords
Bamboo grain structures; Copper wires; Grain boundary sliding; High temperature deformation
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Indexed keywords
COPPER;
CREEP;
CRYSTAL MICROSTRUCTURE;
DIFFUSION;
GRAIN BOUNDARIES;
STRAIN RATE;
STRESSES;
SURFACE TENSION;
THIN COPPER WIRES;
ELECTRIC WIRE;
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EID: 0042631320
PISSN: 13596454
EISSN: None
Source Type: Journal
DOI: 10.1016/S1359-6454(03)00298-2 Document Type: Article |
Times cited : (4)
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References (31)
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