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Volumn 51, Issue 15, 2003, Pages 4611-4619

The effect of low stresses on creep and surface profiles of thin copper wires

Author keywords

Bamboo grain structures; Copper wires; Grain boundary sliding; High temperature deformation

Indexed keywords

COPPER; CREEP; CRYSTAL MICROSTRUCTURE; DIFFUSION; GRAIN BOUNDARIES; STRAIN RATE; STRESSES; SURFACE TENSION;

EID: 0042631320     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6454(03)00298-2     Document Type: Article
Times cited : (4)

References (31)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.