Microstructural evidence for diffusional creep in copper using atomic force microscopy

Scripta Materialia

Volumn 44, Issue 2, 2001, Pages 351-357

  McNee, K R ^a   Greenwood, G W ^a   Jones, H ^a  

^a UNIVERSITY OF SHEFFIELD   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; CREEP TESTING; CRYSTAL MICROSTRUCTURE; DIFFUSION IN SOLIDS; GRAIN BOUNDARIES; OPTICAL MICROSCOPY; PLASTIC DEFORMATION; SCANNING ELECTRON MICROSCOPY; STRESSES;

DIFFUSIONAL CREEP;

COPPER;

EID: 0035251922     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6462(00)00570-4     Document Type: Article

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