Polymeric Protective Coatings for MEMS Wet-Etch Processes

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5342, Issue , 2004, Pages 212-220

  Ruben, Kim ^a   Flaim, Tony ^a   Li, Chenghong ^a  

^a BREWER SCIENCE INC   (United States)

Author keywords

Bulk micromachining; Deep silicon etching; Hydrofluoric acid; Mixed acid etchants; Potassium hydroxide etchant

Indexed keywords

ADHESION; CRYSTAL ORIENTATION; CRYSTALS; ETCHING; HYDROFLUORIC ACID; MICROMACHINING; MULTILAYERS; POLYMERS; POLYSILICON; POTASSIUM COMPOUNDS; PROTECTIVE COATINGS; SILICON;

BULK MICROMACHINING; DEEP SILICON ETCHING; MIXED ACID ETCHANTS; POTASSIUM HYDROXIDE ETCHANTS;

MICROELECTROMECHANICAL DEVICES;

EID: 2142813977     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.523965     Document Type: Conference Paper

References (2)

1. G. Kovacs, N. Maluf, and K. Petersen, "Bulk Micromachining of Silicon", Proceedings of the IEEE, Vol. 86, No. 8, August 1998, pp. 1536-1551.
2. M. Spencer, K. Ruben, C. Li, P. Williams, and T. Flaim, "Polymer protective coating for wet deep silicon etching processes," Proceedings of SPIE, Vol. 4979, January 2003, pp. 79-86.