Graded compositional design of FGM compliant pad for thermoelectric conversion module based on residual thermal stress analysis

Nippon Kikai Gakkai Ronbunshu, A Hen/Transactions of the Japan Society of Mechanical Engineers, Part A

Volumn 62, Issue 594, 1996, Pages 488-492

  Arai, Masayuki ^a   Kambe, Mitsuru ^a   Ogata, Takashi ^a   Takahashi, Yukio ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

COPPER ALLOYS; FINITE ELEMENT METHOD; PALLADIUM ALLOYS; RESIDUAL STRESSES; SILICON NITRIDE; STRESS ANALYSIS; STRUCTURAL DESIGN; TEMPERATURE DISTRIBUTION; THERMAL STRESS; THERMOELECTRIC ENERGY CONVERSION; THERMOELECTRIC POWER PLANTS;

FUNCTIONALLY GRADIENT MATERIAL COMPLIANT PAD;

COMPOSITE STRUCTURES;

EID: 0030083284     PISSN: 03875008     EISSN: None     Source Type: Journal    
DOI: 10.1299/kikaia.62.488     Document Type: Article

References (9)