High reliability second level interconnects using polymer core BGAs

Proceedings - Electronic Components and Technology Conference

Volumn 2, Issue , 2004, Pages 1443-1448

  Movva, Sashidhar ^a   Aguirre, Gerardo ^a  

^a Kyocera America Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BALL GRID ARRAYS (BGA); CYCLIC SHEARING LOADS; ELECTRICAL SIMULATION; THERMAL MISMATCH;

ARRAYS; CYCLIC LOADS; DIGITAL SIGNAL PROCESSING; ELASTIC MODULI; POISSON RATIO; POLYMERS; PRINTED CIRCUIT BOARDS; SIGNAL INTERFERENCE; SOLDERING; THROUGHPUT; WEIBULL DISTRIBUTION;

INTERCONNECTION NETWORKS;

EID: 10444277300     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. John H. Lau, Ball Grid Array Technology, McGraw-Hill (1995), Chapter 1.
2. th Electronic Components and Technology Conf, San Diego, CA, 1999 pp. 426-429.
3. Marie Cole, et al, "Design And Process Effects On The Reliability Of 1.0mm Pitch CBGA"
4. th Electronic Components and Technology Conf, 1995 pp. 1005-1010.
5. rd Electronic Components and Technology Conf, 2003.
6. B. Krietenstein, et al "The Perfect Boundary Approximation Technique Facing the Big Challenge of High Precision Field Computation", Proc XIX International Linear Accelerator Conference, Chicago 1998, pp 860-862
7. Markus Clemens and Thomas Weiland, "Discrete Electromagnetism with the Finite Integration Technique", Journal of Electromagnetic Waves and Propagation / Progress in Electromagnetic Research Monograph Series, 2001.