Laser-induced surface activation of LTCC materials for chemical metallization

IEEE Transactions on Advanced Packaging

Volumn 28, Issue 2, 2005, Pages 259-263

  Kordas K ^a   Pap, A E ^a   Saavalainen, J ^a   Jantunen, H ^a   Moilanen, P ^a   Haapaniemi, E ^a   Leppavuori S ^a  

^a UNIVERSITY OF OULU   (Finland)

Author keywords

Copper; Gold; Laser; Low temperature cofired ceramic (LTCC); Metallization; Nanoparticle; Silver

Indexed keywords

CERAMIC MATERIALS; CHEMICAL VAPOR DEPOSITION; COPPER; ELECTROLESS PLATING; GOLD; LASER APPLICATIONS; LOW TEMPERATURE PROPERTIES; METALLIZING; MICROELECTRONICS; NANOSTRUCTURED MATERIALS; SILVER; THIN FILMS;

CHEMICAL METALLIZATION; LOW TEMPERATURE COFIRED CERAMIC (LTCC);

ELECTRONICS PACKAGING;

EID: 20344385970     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2005.847899     Document Type: Article

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