Excimer laser machining and metallization of vias in aluminum nitride

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Volumn 20, Issue 3, 1997, Pages 241-246

  Lumpp, Janet K ^a,b   Allen, Susan D ^a,c  

^a IEEE   (United States)

^b UNIVERSITY OF KENTUCKY   (United States)

^c FLORIDA STATE UNIVERSITY   (United States)

Author keywords

Ablation; AlN; Aluminum metallization; Aluminum nitride; Copper metallization; Excimer laser; Micromachining; Via

Indexed keywords

ALUMINUM COMPOUNDS; EXCIMER LASERS; LASER ABLATION; METALLIZING; MICROELECTRONICS; MICROMACHINING; PRINTED CIRCUIT BOARDS; SHOCK WAVES; SUBSTRATES; THERMAL CONDUCTIVITY OF SOLIDS; THERMAL EXPANSION;

ALUMINUM NITRIDE; EXCIMER LASER MACHINING;

ELECTRONICS PACKAGING;

EID: 0031198491     PISSN: 10709894     EISSN: None     Source Type: Journal    
DOI: 10.1109/96.618223     Document Type: Article

References (13)

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