Embedding ceramic thick-film capacitors into printed wiring boards

Materials Research Society Symposium Proceedings

Volumn 833, Issue , 2005, Pages 143-151

  Borland, William ^a   Doyle, Marc ^a   Dellis, Lynne ^a   Renovales, Olga ^a   Majumdar, Diptarka ^a  

^a DUPONT COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EMBEDDED CAPACITORS; SCREEN-PRINTED CAPACITORS; THICK-FILM CAPACITORS; THICK-FILM FURNACE;

BARIUM TITANATE; EMBEDDED SYSTEMS; MICROPROCESSOR CHIPS; PRINTED CIRCUIT BOARDS; RESISTORS; THICK FILMS;

CERAMIC CAPACITORS;

EID: 20344376661     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

1. W. J. Borland and S. Ferguson, "Embedded Passive Components in Printed Wiring Boards: A Technology Review," Circuitree, March 2001.
2. D. MacGregor, "Standards Development Efforts for Embedded Passive Materials," IPC Annual Meeting, October 2001.
3. P. Sandborn, B. Etienne, and D. Becker, "Analysis of the Cost of Embedded Passives in Printed Circuit Boards," IPC Annual Meeting, October 2001.
4. J. Savic, R. T. Croswell, A. Tungare, G. Dunn, T. Tang, R. Lempkowski, M. Zhang, and T. Lee, "Embedded Passives Technology Implementation in RF Applications," IPC Expo, March 2002.
5. J. J. Felten and S. Ferguson "Embedded Ceramic Resistors and Capacitors in PWB - Process and Design," IPC Expo, March 2002.
6. AEPT website: www.aept.ncms.org
7. Japanese patent application JP 02153589 to Ibiden.
8. W. Borland, J. Felten, L. Dellis, S. Ferguson, D. Majumdar, A. Jones, M. Lux, R. Traylor, and M. Doyle, "Ceramic Resistors and Capacitors Embedded in Organic Printed Circuit Boards", Proceedings of IPACK03, International Electronics Packaging Technical Conference and Exhibition, July 6-11, 2003, Maui, Hawaii, USA.
9. th European Microelectronics and Packaging Conference & Exhibition, Friedrichshafen, Germany, 23-25 June 2003.
10. R. Snogren, "Embedded Passives - A Novel Approach Using Ceramic Thick Film Technology", Proceedings of IPACK03, International Electronics Packaging Technical Conference and Exhibition, July 6-11, 2003, Maui, Hawaii, USA.