Embedded passives - A novel approach using ceramic thick film technology

Advances in Electronic Packaging

Volumn 2, Issue , 2003, Pages 747-755

  Snogren, Richard C ^a  

^a Coretec Inc ^*  (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC CAPACITORS; COMPUTER AIDED DESIGN; ETCHING; PASSIVE NETWORKS; PRINTED CIRCUIT BOARDS; RESISTORS; SUBSTRATES; THERMAL EFFECTS; THICK FILMS; CAPACITORS; CELLULAR TELEPHONE SYSTEMS; CERAMIC MATERIALS; CHIP SCALE PACKAGES; MOBILE PHONES; PRINTED CIRCUIT MANUFACTURE; TELECOMMUNICATION EQUIPMENT; TELEPHONE; TELEPHONE SETS;

CERAMIC THICK FILM TECHNOLOGY; EMBEDDED PASSIVES; CELL PHONE; CIRCUIT BOARDS; MANUFACTURING PROCESS; MICROVIAS; NEW MATERIAL; OTHER APPLICATIONS; PASSIVE COMPONENTS; PCB INDUSTRY; ROBUST MATERIALS; THICK FILM RESISTORS; THICK FILM TECHNOLOGY;

ELECTRONICS PACKAGING; PRINTED CIRCUIT BOARDS;

EID: 1242264327     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/ipack2003-35244     Document Type: Conference Paper

References (6)

1. Borland, W., Felten, J., Dellis, L., Ferguson, S., Majumdar, D., Jones, A., Lux, M., Traylor, R., Doyle, M., 2003, "Ceramic Resistors and Capacitors Embedded in Organic Printed Wiring Boards," Proceedings of IPACK03, International electronics Packaging Technical Conference and Exhibition
2. Borland, W., Ferguson, S., March, 2001, "Embedded Passive Components in Printed Wiring Boards: A Technology Review," CircuiTree, Business News Publishing Co., Troy, MI.
3. th International Symposium on Microelectronics (IMAPS), Baltimore, MD
4. AEPT Web Site: www.aept.ncms.org
5. Sandborn, P., Etienne, B., Becker, D., "Analysis of the Cost of Embedded Passives in Printed Circuit Boards", CALCE Electronic Products and systems Center, University of Maryland, College Park, MD
6. Fjeldsted, K., Chase, S., March, 2002 "Embedded Passives, Laser Trimmed Resistors," CircuiTree, Business News Publishing Co., Troy, MI