A new mixed organic layer for enhanced corrosion protection of electric contacts

Proceedings of the 50th IEEE Holm Conference on Electrical Contacts and the 22nd International Conference on Electrical Contacts

Volumn , Issue , 2004, Pages 274-280

  Noel S ^a   Lecaude N ^a   Alamarguy, D ^b   Tristani, L ^b   Laffineur, F ^c   Mekhalif, Z ^c   Delhalle, J ^c   Tortech, L ^d   Geribaldi S ^d   Guittard, F ^d   Di Meo, A ^e   Gavezotti, P ^e  

^a SUPELEC   (France)

^b FCI   (France)

^c UNIVERSITY OF NAMUR   (Belgium)

^d UNIVERSITÉ CÔTE D'AZUR   (France)

^e Solvay Solexis   (Italy)

Author keywords

[No Author keywords available]

Indexed keywords

ATMOSPHERIC CORROSION; CHEMICAL BONDS; CORROSION PROTECTION; ELECTRIC CONNECTORS; ELECTRIC RESISTANCE; GOLD PLATING; INTERFACIAL ENERGY; MOLECULAR STRUCTURE; SUBSTRATES; SURFACE PROPERTIES;

COHESION; CONTACT RESISTANCE; METALLIC SURFACES; ORGANIC LAYER;

ELECTRIC CONTACTS;

EID: 20144387853     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/holm.2004.1353130     Document Type: Conference Paper

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