Electronic transport through aromatic thiol monolayer assembled in the nano via-hole electrode

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 44, Issue 1 B, 2005, Pages 530-534

  Lee, Changjin ^a   Kang, Yongku ^a   Seo, Kyungja ^a   Shin, Youn Mi ^a   Kim, Jae Ho ^b   Choi, Sung Wook ^b   Kim, Jinhee ^c   Soh, Hei Mi ^c   Lee, Hoyoung ^d   Kim, Dohyun ^d,e   Song, Chung Kun ^e  

^a Korea Research Institute of Chemical Technology   (South Korea)

^b Ajou University   (South Korea)

^c Korea Research Institute of Standards and Science   (South Korea)

^d Electronics and Telecommunications Research Institute (ETRI)   (South Korea)

^e Dong A University   (South Korea)

Author keywords

Molecular diode; Molecular scale electronics; Nanosize via hole device; Self assembled monolayer

Indexed keywords

AROMATIC COMPOUNDS; DIODES; ELECTRIC PROPERTIES; ELECTRODES; FABRICATION; INSULATING MATERIALS; SILICON NITRIDE;

INSULATING LAYERS; MOLECULAR DIODES; MOLECULAR SCALE ELECTRONICS; NANOSIZE VIA-HOLE DEVICE;

MONOLAYERS;

EID: 20144386798     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/JJAP.44.530     Document Type: Conference Paper

References (20)

1. L. A. Bumm, J. J. Arnold, M. T. Cygan, T. D. Cunbar, T. P. Burgin, L. Jones II, D. L. Allara, J. M. Tour and P. S. Weiss: Science 271 (1996) 1705.
2. M. A. Reed, C. Zhou, C. J. Miller, T. P. Burgin and J. M. Tour: Science 278 (1997) 252.
3. Y. Chen, G.-Y. Jung, D. A. A. Ohlberg, X. Li, D. R. Stewart, J. O. Jeppesen, K. A. Nielsen, J. F. Stoddart and R. S. Williams: Nanotechnology 14 (2003) 462.
4. J. Chen, M. A. Reed, A. M. Rawlett and J. M. Tour: Science 286 (1999) 1550.
5. R. McCreery: Electrochem. Soc. Interface 13 (2004) 25.
6. C. R. Kagan and M. A. Ratner: MRS Bull. 29 (2004) 376.
7. F.-R. F. Fan, Y. Yao, L. Cai, L. Cheng, J. M. Tour and A. J. Bard: J. Am. Chem. Soc. 126 (2004) 4035.
8. C. P. Collier, G. Mattersteig, E. W. Wong, Y. Luo, K. Beverly, J. Sampaio, F. M. Raymo, J. F. Stoddart and J. R. Heath: Science 289 (2000) 1172.
9. C. Zhou, M. R. Deshpande, M. A. Reed, L. Jones II and J. M. Tour: Appl Phys. Lett. 71 (1997) 611.
10. J. Chen, W. Wang, M. A. Reed, A. M. Rawlett, D. W. Price and J. M. Tour: Appl. Phys. Lett. 77 (2000) 1224.
11. R. G. Nuzzo, B. R. Zegarski and L. H. Dubois: J. Am. Chem. Soc. 109 (1987) 733.
12. L. Strong and G. M. Whitsides: Langmuir 4 (1988) 546.
13. A. R. Bishop and R. G. Nuzzo: Curr. Opin. Colloid Interface Sci. 1 (1996) 127.
14. M. D. Porter, T. B. Bright, D. L. Allara and C. E. D. Chidsey: J. Am. Chem. Soc. 109 (1987) 3559.
15. E. Sabatani, J. Cohen-Boulakia, M. Bruening and I. Rubinstein: Langmuir 9 (1993) 2974.
16. Y.-T. Tao, C.-C. Wu, J.-Y. Eu and W.-L. Lin: Langmuir 13 (1997) 4018.
17. J. M. Tour, L. Jones II, D. L. Pearson, J. J. S. Lamba, T. P. Burgin, G. M. Whitesides, D. L. Allara, A. N. Parikh and S. V. Atr: J. Am. Chem. Soc. 117 (1995) 9529.
18. J. J. Stapleton, P. Harder, T. A. Daniel, M. Reinard, H. Skulason, Y. Yao, D. W. Price, J. M. Tour and D. L. Allara: Langmuir 19 (2003) 8245.
19. D.-H. Kim, C.-K. Song, Y. Kang, C. Lee, H. Lee, H. M. So and J. Kim: J. Kor. Phys. Soc. 45 (2004) 470.
20. W. Wang, T. Lee and M. A. Reed: Physica E 19 (2003) 117.