Power electronics modules for inverter applications using flip-chip on flex-circuit technology

Conference Record - IAS Annual Meeting (IEEE Industry Applications Society)

Volumn 3, Issue , 2004, Pages 1526-1533

  Shah, H N ^a   Xiao, Y ^a   Chow, T P ^a   Gutmann, R J ^a   Olson, E R ^b   Park, S H ^b   Lee, W K ^b   Connors, J J ^b   Jahns, T M ^b   Lorenz, R D ^b  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

^b UNIVERSITY OF WISCONSIN MADISON   (United States)

Author keywords

Active gate drives; Packaging; Planar interconnection; Power modules; Silicon carbide semiconductors

Indexed keywords

ACTIVE GATE DRIVES; PLANAR INTERCONNECTION PACKAGING; POWER MODULES; SILICON CARBIDE SEMICONDUCTORS;

AIR CONDITIONING; ALGORITHMS; ELECTRIC INVERTERS; ELECTRIC POWER SYSTEM INTERCONNECTION; ELECTRONICS PACKAGING; HEAT PIPES; HEATING; SEMICONDUCTOR MATERIALS; SILICON CARBIDE; SOLDERING; VENTILATION;

FLIP FLOP CIRCUITS;

EID: 19944375427     PISSN: 01972618     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IAS.2004.1348673     Document Type: Conference Paper

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