RF module using MCM-L and BGA technology for 5GHz WLAN application

Conference Proceedings - 33rd European Microwave Conference, EuMC 2003

Volumn 3, Issue , 2003, Pages 895-898

  Hiura, Shigeru ^a   Ishida, Masaaki ^a   Kitahara, Takaya ^a   Yamamoto, Tetsuya ^a  

^a Toshiha Corporation   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

FREQUENCY BANDS; WIRELESS LOCAL AREA NETWORKS (WLAN);

ANTENNA SWITCHES; DESIGN CONCEPT; DIELECTRIC SUBSTRATES; ELECTRICAL PERFORMANCE; FLIP CHIP TECHNOLOGIES; RADIO FREQUENCIES; TRANSMISSION LINE CHARACTERISTICS; WLAN APPLICATIONS;

TECHNOLOGY;

EID: 19644378106     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EUMC.2003.177624     Document Type: Conference Paper

References (5)

1. Supplement to IEEE Std 802.11-1999, part 11: Wireless LAN medium access control (MAC) and physical layer (PHY) specifications, High-speed physical layer in the 5GHz band, ISO/IEC 8802-11: 1999/Amd 1:2000(E).
2. W. Diels, K. Vaesen, P. Wambacq, S. Donnay, W. D. Raedt, M. Engels, and I. Bolsens, "Single-package integration of RF blocks for a 5GHz WLAN application," IEEE Transactions on Advanced Packaging, vol. 24, no. 3, pp. 384-391, August 2001.
3. S. Pinel, S. Chakraborty, M. Roellig, R. Kunze, S. Mandal, H. Liang, C-H. Lee, R. Li, K. Lim, G. White, M. Tentzeris, and J. Laskar, "3D integrated LTCC module using uBGA technology for compact C-band RF front-end module," IEEE MTT-S Microwave Symposium Digest, vol. 3, pp. 1553-1556, June 2002.
4. C. Q. Scrantom, J. C. Lawson, "LTCC technology: where we are and where we're going-II," IEEE MTT-S Symposium, pp. 193-200, February 1999
5. M. F. Caggiano, J. Ou, S. Bulumulla, and D. Lischner, "RF electrical measurements of fine pitch BGA packages," IEEE Transactions on Components and Packaging Technologies, vol. 24, no. 2, pp. 233-240, June 2001.