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Volumn 44, Issue , 2004, Pages 525-532

Correlation of heat transfer data to film thickness data of the thin film found in spray cooling

Author keywords

[No Author keywords available]

Indexed keywords

BOILING LIQUIDS; COOLING SYSTEMS; ELECTRONIC EQUIPMENT; HEAT FLUX; HOLOGRAPHY; NETWORKS (CIRCUITS); NOZZLES; THIN FILMS;

EID: 19544370688     PISSN: 10716947     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2004-62350     Document Type: Conference Paper
Times cited : (7)

References (17)
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  • 3
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  • 4
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    • (2003)
    • Patel, C.D.1    Bash, C.E.2
  • 5
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    • Method and apparatus for high heat flux heat transfer. U.S. Patent Number 6,571,569
    • D. P. Rini, H. R. Anderson, J. S. Kapat, and L. Chow. Method and apparatus for high heat flux heat transfer. U.S. Patent Number 6,571,569, 2003.
    • (2003)
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  • 6
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  • 7
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  • 8
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    • Rini, D.P.1    Chen, R.-H.2    Chow, L.C.3
  • 9
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  • 12
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.