SCOPUS 정보 검색 플랫폼

Advances in Electronic Packaging

Volumn 2, Issue , 2001, Pages 617-624

An overview on the system packaging of the CRAY SV2 supercomputer

(1) Pautsch, G W a

a CRAY INC (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AIR DISTRIBUTION SYSTEMS; SPRAY EVAPORATIVE COOLING (SEC);

CAPACITORS; COMPUTER ARCHITECTURE; COMPUTER WORKSTATIONS; COOLING; FORCED CONVECTION; HEAT FLUX; HEAT SINKS; INDUCTANCE; MICROPROCESSOR CHIPS; MONITORING; PRINTED CIRCUIT BOARDS; SUPERCOMPUTERS;

ELECTRONICS PACKAGING;

EID: 0348170989 PISSN: None EISSN: None Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper

Times cited : (16)

References (10)

1
- 0343862470
- Research Needs in Electronic Cooling; Future Challenges
- Bar-Cohen, A., Mudawwar, I., and Whalen, B., "Research Needs in Electronic Cooling; Future Challenges", Proceedings of a Workshop sponsored by NSF and Purdue, 1988
- (1988) Proceedings of a Workshop Sponsored by NSF and Purdue
- Bar-Cohen, A.¹ Mudawwar, I.² Whalen, B.³

2
- 0027386747
- Thermal Management of Electronic Components with Dielectric Liquids
- Bar-Cohen, A., "Thermal Management of Electronic Components with Dielectric Liquids", JSME International Journal, Series B, vol. 36, No 1, 1993
- (1993) JSME International Journal, Series B , vol.36 , Issue.1
- Bar-Cohen, A.¹

3
- 0342556919
- Liquid Cooling for Electronic Equipment
- March
- Bergles, A. E., "Liquid Cooling for Electronic Equipment", International Symposium on Cooling Technology for Electronic Equipment, March 1987
- (1987) International Symposium on Cooling Technology for Electronic Equipment
- Bergles, A.E.¹

4
- 5844401334
- Electronic Module Coolabilty Analysis
- ASME
- Chu, R. C., and Chrysler, G. M., "Electronic Module Coolabilty Analysis", EEP-Vol. 19-2, Advances in Electronic Packaging-1997 Volume 2, ASME 1997
- (1997) Advances in Electronic Packaging-1997 Volume 2 , vol.2 EEP-19-2
- Chu, R.C.¹ Chrysler, G.M.²

5
- 0000340765
- Convection Heat Transfer in Electronic Equipment Cooling
- Nov.
- Incropera, F. P., "Convection Heat Transfer in Electronic Equipment Cooling", Journal of heat Transfer, Nov. 1988, Vol. 110/1097
- (1988) Journal of Heat Transfer , vol.110 , Issue.1097
- Incropera, F.P.¹

6
- 0002817616
- Liquid-Cooling of Electronic Equipment: Where Does It Offer Viable Solutions?
- ASME
- Nakayama, W., "Liquid-Cooling of Electronic Equipment: Where Does It Offer Viable Solutions?", EEP-Vol. 19-2, Advances in Electronic Packaging-1997 Volume 2, ASME 1997
- (1997) Advances in Electronic Packaging-1997 Volume 2 , vol.2 EEP-19-2
- Nakayama, W.¹

7
- 0342297942
- Thermal Management of Multi-chip Modules with Evaporative Spray Cooling
- Pautsch, G. W., Bar-Cohen, A.,"Thermal Management of Multi-chip Modules with Evaporative Spray Cooling" ASME Advances in Electronic Packaging 1999, EEP-Vol.26-2, 1453-1463
- (1999) ASME Advances in Electronic Packaging 1999 , vol.EEP-26-2 , pp. 1453-1463
- Pautsch, G.W.¹ Bar-Cohen, A.²

8
- 0342991163
- IBM Corporation
- Simons, R. E., "Bibliography of Heat Transfer in Electronic Equipment", 1989, IBM Corporation
- (1989) Bibliography of Heat Transfer in Electronic Equipment
- Simons, R.E.¹

9
- 0028755012
- High Heat Flux Spray Cooling: A Review
- ASME
- Sehmbey, M. S., Chow, L. C., Pais, M. R. and Mahefkey, T., "High Heat Flux Spray Cooling: A Review", HTD-Vol. 301, Heat Transfer in High Heat Flux Systems, ASME 1994
- (1994) Heat Transfer in High Heat Flux Systems , vol.HTD-301
- Sehmbey, M.S.¹ Chow, L.C.² Pais, M.R.³ Mahefkey, T.⁴

10
- 0003860827
- Van Nostrand Reinhold Publishing
- Tummala, R. R, Rymaszewski, E. J., 1989, Microelectronics Packaging Handbook Van Nostrand Reinhold Publishing
- (1989) Microelectronics Packaging Handbook
- Tummala, R.R.¹ Rymaszewski, E.J.²

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.