Solderability of electroless deposited Ni-P coatings with Sn-3.8Ag-0.7Cu and Sn-3.5Ag lead-free solder alloys

Circuit World

Volumn 31, Issue 3, 2005, Pages 32-39

  Li, Dezhi ^a   Liu, Changqing ^a   Conway, Paul P ^a  

^a LOUGHBOROUGH UNIVERSITY   (United Kingdom)

Author keywords

Alloys; Coating processes; Soldering

Indexed keywords

ATOMIC FORCE MICROSCOPY; COATINGS; ELECTROLESS PLATING; METALLIZING; MICROSTRUCTURE; NICKEL; OXIDATION; SCANNING ELECTRON MICROSCOPY; SOLDERING ALLOYS; SURFACE ROUGHNESS; TIN ALLOYS; X RAY PHOTOELECTRON SPECTROSCOPY;

LEAD FREE SOLDER ALLOYS; SOLDERABILITY; UNDER BUMP METALLIZATION;

FLIP CHIP DEVICES;

EID: 19444380388     PISSN: 03056120     EISSN: None     Source Type: Journal    
DOI: 10.1108/03056120510585054     Document Type: Article

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