-
1
-
-
0026910294
-
Heat transfer regimes in microstructures
-
Flik, M.I., Choi, B.I., and Goodson, K.E., 1992, "Heat transfer regimes in microstructures", ASME Journal of Heat Transfer, 114, pp. 666-674.
-
(1992)
ASME Journal of Heat Transfer
, vol.114
, pp. 666-674
-
-
Flik, M.I.1
Choi, B.I.2
Goodson, K.E.3
-
2
-
-
0000137070
-
Microscale energy transport in solids
-
C. L. Tien et. al., Eds., Taylor & Francis, Chap. 1
-
Majumdar, A., 1998, "Microscale energy transport in solids", Microscale Energy Transport, C. L. Tien et. al., Eds., Taylor & Francis, Chap. 1.
-
(1998)
Microscale Energy Transport
-
-
Majumdar, A.1
-
4
-
-
0034562665
-
Particularities of heat conduction in nanostructures
-
Chen, G., 2000, "Particularities of heat conduction in nanostructures", Journal of Nanoparticle Research, 2, pp. 199-204.
-
(2000)
Journal of Nanoparticle Research
, vol.2
, pp. 199-204
-
-
Chen, G.1
-
5
-
-
71749104133
-
Microscale heat conduction in dielectric thin films
-
Majumdar, A., 1993, "Microscale heat conduction in dielectric thin films", ASME Journal of Heat Transfer, 115, pp. 7-16.
-
(1993)
ASME Journal of Heat Transfer
, vol.115
, pp. 7-16
-
-
Majumdar, A.1
-
6
-
-
0003406742
-
-
John Wiley & Sons, Inc., Chaps. 4, 5
-
Kittel, C., 1996, Introduction to Solid State Physics, Seventh edition, John Wiley & Sons, Inc., Chaps. 4, 5.
-
(1996)
Introduction to Solid State Physics, Seventh Edition
-
-
Kittel, C.1
-
7
-
-
0003470014
-
-
Saunders College Publishing, Chaps. 16, 22, 23
-
Ashcroft, N.W., and Mermin, N.D., 1976, Solid State Physics, Saunders College Publishing, Chaps. 16, 22, 23.
-
(1976)
Solid State Physics
-
-
Ashcroft, N.W.1
Mermin, N.D.2
-
8
-
-
0008493368
-
Effect of gate voltage on hot-electron and hot-phonon interaction and transport in a submicrometer transistor
-
Majumdar, A., Fushinobu, K., and Hijikata, K., 1995, "Effect of gate voltage on hot-electron and hot-phonon interaction and transport in a submicrometer transistor", Journal of Applied Physics, 77(12), pp. 6686-6694.
-
(1995)
Journal of Applied Physics
, vol.77
, Issue.12
, pp. 6686-6694
-
-
Majumdar, A.1
Fushinobu, K.2
Hijikata, K.3
-
9
-
-
0029229053
-
Heat generation in sub-micron GaAs MESFETs
-
EEP, Advances in Electronic Packaging
-
Fushinobu, K., Hijikata, K., and Majumdar, A., 1995a, "Heat generation in sub-micron GaAs MESFETs", Proceedings of International Intersociety Electronic Packaging Conference, EEP-Vol. 10-2, Advances in Electronic Packaging, pp. 897-902.
-
(1995)
Proceedings of International Intersociety Electronic Packaging Conference
, vol.10
, Issue.2
, pp. 897-902
-
-
Fushinobu, K.1
Hijikata, K.2
Majumdar, A.3
-
10
-
-
0029251471
-
Heat generation and transport in submicron semiconductor devices
-
Fushinobu, K., Majumdar, A., and Hijikata, K., 1995b, "Heat generation and transport in submicron semiconductor devices", ASME Journal of Heat Transfer, 117, pp. 25-31.
-
(1995)
ASME Journal of Heat Transfer
, vol.117
, pp. 25-31
-
-
Fushinobu, K.1
Majumdar, A.2
Hijikata, K.3
-
11
-
-
0001187605
-
Concurrent thermal and electrical modeling of sub-micrometer silicon devices
-
Lai, J., and Majumdar, A., 1996, "Concurrent thermal and electrical modeling of sub-micrometer silicon devices", Journal of Applied Physics, 79(9), pp. 7353-7361.
-
(1996)
Journal of Applied Physics
, vol.79
, Issue.9
, pp. 7353-7361
-
-
Lai, J.1
Majumdar, A.2
-
12
-
-
0003935224
-
-
Ph.D thesis, Stanford University, Stanford, CA
-
Ju, Y.S., 1999, Microscale heat conduction in integrated circuits and their constituent films, Ph.D thesis, Stanford University, Stanford, CA.
-
(1999)
Microscale Heat Conduction in Integrated Circuits and Their Constituent Films
-
-
Ju, Y.S.1
-
13
-
-
0242360606
-
-
Ph. D. thesis, Stanford University, Stanford, CA
-
Sverdrup, P.G., 2000, "Simulation and thermometry of sub-continuum heat transport in semiconductor devices", Ph. D. thesis, Stanford University, Stanford, CA.
-
(2000)
Simulation and Thermometry of Sub-continuum Heat Transport in Semiconductor Devices
-
-
Sverdrup, P.G.1
-
14
-
-
0343426600
-
Impact of heat source localization on conduction cooling of silicon-on-insulator devices
-
Sverdrup, P.G., Ju, Y.S., and Goodson, K.E., 1999, "Impact of heat source localization on conduction cooling of silicon-on-insulator devices", International Conference on Modeling and Simulation of Microsystems, pp. 390-402.
-
(1999)
International Conference on Modeling and Simulation of Microsystems
, pp. 390-402
-
-
Sverdrup, P.G.1
Ju, Y.S.2
Goodson, K.E.3
-
15
-
-
0033710863
-
Sub-continuum thermal simulations of deep sub-micron devices under BSD conditions
-
Sverdrup, P.G., Banerjee, K., Dai, C, Shih, W., Dutton, R.W., and Goodson, K.E., 2000, "Sub-continuum thermal simulations of deep sub-micron devices under BSD conditions", International Conference on Simulation Semiconductor Processes and Devices, pp. 54-57.
-
(2000)
International Conference on Simulation Semiconductor Processes and Devices
, pp. 54-57
-
-
Sverdrup, P.G.1
Banerjee, K.2
Dai, C.3
Shih, W.4
Dutton, R.W.5
Goodson, K.E.6
-
16
-
-
0035244549
-
Subcontinuum simulations of heat conduction in silicon-on-insulator transistors
-
Sverdrup, P.G., Ju, Y.S., Goodson, K.E., 2001, "Subcontinuum simulations of heat conduction in silicon-on-insulator transistors", ASME Journal of Heat Transfer, 123, pp. 130-137.
-
(2001)
ASME Journal of Heat Transfer
, vol.123
, pp. 130-137
-
-
Sverdrup, P.G.1
Ju, Y.S.2
Goodson, K.E.3
-
17
-
-
0035716659
-
Localized heating effects and scaling of sub-0.18 micron CMOS devices
-
Pop., E., Banerjee, K., Sverdrup, P.G., Dutton, R., and Goodson, K., 2001, "Localized heating effects and scaling of sub-0.18 micron CMOS devices", IEEE International Electron Devices Meeting.
-
(2001)
IEEE International Electron Devices Meeting
-
-
Pop, E.1
Banerjee, K.2
Sverdrup, P.G.3
Dutton, R.4
Goodson, K.5
-
18
-
-
0001378057
-
Two-fluid theory of thermal conductivity of dielectric crystals
-
Armstrong, B. H., 1981, "Two-fluid theory of thermal conductivity of dielectric crystals", Physical Review B, 23(2), pp. 883-899.
-
(1981)
Physical Review B
, vol.23
, Issue.2
, pp. 883-899
-
-
Armstrong, B.H.1
-
19
-
-
0038960224
-
N processes, the relaxation-time approximation, and lattice thermal conductivity
-
Armstrong, B.H., 1985, "N processes, the relaxation-time approximation, and lattice thermal conductivity", Physical Review B, 32(6), pp. 3381-3390.
-
(1985)
Physical Review B
, vol.32
, Issue.6
, pp. 3381-3390
-
-
Armstrong, B.H.1
-
20
-
-
1842764443
-
Small heat source effects in sub-micron heat conduction
-
New York, NY
-
Narumanchi, S.V.J., Murthy, J.Y., and Amon, C.H., 2001, "Small heat source effects in sub-micron heat conduction", Proceedings of the International Mechanical Engineering Congress and Exposition (IMECE), New York, NY.
-
(2001)
Proceedings of the International Mechanical Engineering Congress and Exposition (IMECE)
-
-
Narumanchi, S.V.J.1
Murthy, J.Y.2
Amon, C.H.3
-
21
-
-
0242286505
-
Simulation of unsteady small heat source effects in sub-micron heat conduction
-
accepted
-
Narumanchi, S.V.J., Murthy, J.Y., and Amon, C.H., 2003, "Simulation of unsteady small heat source effects in sub-micron heat conduction", ASME Journal of Heat Transfer (accepted).
-
(2003)
ASME Journal of Heat Transfer
-
-
Narumanchi, S.V.J.1
Murthy, J.Y.2
Amon, C.H.3
-
22
-
-
1842628642
-
Computations of sub-micron heat transport in silicon accounting for phonon dispersion
-
Paper No. HT2003-47490, Las Vegas, NV
-
Narumanchi, S.V.J., Murthy, J.Y., and Amon, C.H., 2003, "Computations of sub-micron heat transport in silicon accounting for phonon dispersion", Proceedings of the ASME Summer Heat Transfer Conference, Paper No. HT2003-47490, Las Vegas, NV.
-
(2003)
Proceedings of the ASME Summer Heat Transfer Conference
-
-
Narumanchi, S.V.J.1
Murthy, J.Y.2
Amon, C.H.3
-
23
-
-
0042444077
-
Thermal conductivity and lattice vibrational modes
-
edited by Seitz, F. and Thurnbull, D. (Academic Press, New York)
-
Klemens, P.G., 1958, "Thermal conductivity and lattice vibrational modes", in Solid State Physics, edited by Seitz, F. and Thurnbull, D. (Academic Press, New York), Vol. 7, pp. 1-98.
-
(1958)
Solid State Physics
, vol.7
, pp. 1-98
-
-
Klemens, P.G.1
-
24
-
-
0002420211
-
Theory of the thermal conductivity of solids
-
edited by Tye, R.P. (Academic Press, London)
-
Klemens, P.G., 1969, "Theory of the thermal conductivity of solids", in Thermal Conductivity, edited by Tye, R.P. (Academic Press, London), Vol. 1, pp. 1-68.
-
(1969)
Thermal Conductivity
, vol.1
, pp. 1-68
-
-
Klemens, P.G.1
-
25
-
-
33645058229
-
Anharmonic thermal resistivity of dielectric crystals at low temperatures
-
Han, Y.-J., and Klemens, P.G., 1993, "Anharmonic thermal resistivity of dielectric crystals at low temperatures", Physical Review B, 48(9), pp. 6033-6042.
-
(1993)
Physical Review B
, vol.48
, Issue.9
, pp. 6033-6042
-
-
Han, Y.-J.1
Klemens, P.G.2
-
26
-
-
0001129497
-
Significant decrease in the lattice thermal conductivity due to phonon confinement in a free-standing semiconductor quantum well
-
Balandin, A., and Wang, K.L., 1998, "Significant decrease in the lattice thermal conductivity due to phonon confinement in a free-standing semiconductor quantum well", Physical Review B, 58(3), pp. 1544-1549.
-
(1998)
Physical Review B
, vol.58
, Issue.3
, pp. 1544-1549
-
-
Balandin, A.1
Wang, K.L.2
-
27
-
-
36149027857
-
Analysis of lattice thermal conductivity
-
Holland, M.G., 1963, "Analysis of lattice thermal conductivity", Physical Review, 132(6), pp. 2461-2471.
-
(1963)
Physical Review
, vol.132
, Issue.6
, pp. 2461-2471
-
-
Holland, M.G.1
-
28
-
-
0000040490
-
Thermal conductivity: Nonmetallic solids
-
IFI/Plenum, NY
-
Touloukian, Y.S. and Buyco, E.H., 1970, "Thermal conductivity: nonmetallic solids", from Thermophysical Properties of Matter, IFI/Plenum, NY, Vol. 2.
-
(1970)
Thermophysical Properties of Matter
, vol.2
-
-
Touloukian, Y.S.1
Buyco, E.H.2
-
29
-
-
51149220754
-
Thermal boundary resistance
-
Swartz, E.T., and Pohl, R.O., 1989, "Thermal boundary resistance", Reviews of Modern Physics, 61(3), pp. 605-668.
-
(1989)
Reviews of Modern Physics
, vol.61
, Issue.3
, pp. 605-668
-
-
Swartz, E.T.1
Pohl, R.O.2
-
31
-
-
0028468271
-
Finite Volume method for radiation heat transfer
-
Chai, J.C., Lee, H.S., and Patankar, S.V., 1994, "Finite Volume method for radiation heat transfer", Journal of Thermophysics and Heat Transfer, 8(3), pp. 419-425.
-
(1994)
Journal of Thermophysics and Heat Transfer
, vol.8
, Issue.3
, pp. 419-425
-
-
Chai, J.C.1
Lee, H.S.2
Patankar, S.V.3
-
32
-
-
0032116572
-
Finite volume method for radiative heat transfer using unstructured meshes
-
Murthy, J.Y., and Mathur, S.R., 1998, "Finite volume method for radiative heat transfer using unstructured meshes", Journal of Thermophysics and Heat Transfer, 12(3), pp. 313-321.
-
(1998)
Journal of Thermophysics and Heat Transfer
, vol.12
, Issue.3
, pp. 313-321
-
-
Murthy, J.Y.1
Mathur, S.R.2
-
33
-
-
0024165638
-
Curvature-compensated convective transport: SMART, a new boundedness-preserving transport algorithm
-
Gaskell, P.H., and Lau, A.K.C, 1988, "Curvature-compensated convective transport: SMART, a new boundedness-preserving transport algorithm", International Journal for Numerical Methods in Fluids, 8, pp. 617-641.
-
(1988)
International Journal for Numerical Methods in Fluids
, vol.8
, pp. 617-641
-
-
Gaskell, P.H.1
Lau, A.K.C.2
-
34
-
-
0028467986
-
Normalized variable and space formulation methodology for high-resolution schemes
-
Darwish, M.S., and Moukalled, F.H., 1994, "Normalized variable and space formulation methodology for high-resolution schemes", Numerical Heat Transfer, Part B, 26, pp. 79-96.
-
(1994)
Numerical Heat Transfer, Part B
, vol.26
, pp. 79-96
-
-
Darwish, M.S.1
Moukalled, F.H.2
-
35
-
-
0000135289
-
Fullband Monte Carlo investigation of carrier trends in the scaling of metal-oxide-semiconductor field-effect transistors
-
Duncan, A., Ravaioli, U., and Jakumeit, J., 1998, "Fullband Monte Carlo investigation of carrier trends in the scaling of metal-oxide- semiconductor field-effect transistors", IEEE Transactions on Electron Devices, 45, pp. 867-876.
-
(1998)
IEEE Transactions on Electron Devices
, vol.45
, pp. 867-876
-
-
Duncan, A.1
Ravaioli, U.2
Jakumeit, J.3
|