Contact reliability of innovative compliant interconnects for next generation electronic packaging

American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP

Volumn 3, Issue , 2003, Pages 9-17

  Ma, Lunyu ^a   Zhu, Qi ^a   Sitaraman, Suresh K ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Compliant interconnect; Electronic packaging; Finite element method; Free air; Reliability; Sliding contact; Stress engineering; Wear

Indexed keywords

COMPRESSIVE STRESS; COSTS; DEPOSITION; FINITE ELEMENT METHOD; INTEGRATED CIRCUITS; MATHEMATICAL MODELS; MICROELECTRONICS; RELIABILITY; THERMAL CYCLING; THICK FILMS; WEAR OF MATERIALS;

COMPLIANT INTERCONNECTS; FREE-AIR; SLIDING CONTACTS; STRESS ENGINEERING;

ELECTRONICS PACKAGING;

EID: 1942472612     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2003-41753     Document Type: Conference Paper

References (21)

1. The International Technology Roadmap for Semiconductors (ITRS) - Assembly and Packaging (2002 Update), Semiconductor Industry Association, 2002, pp.109.
2. Tummala, R.R., "Fundamentals of Microsystems Packaging", McGraw-Hill, New York, NY, 2001, ISBN 0-07-137169-9
3. Hoffman, D.W. and Thornton, J.A., "Internal Stresses in Cr, Mo, Ta and Pt Films Deposited by Sputtering From a Planar Magnetron Source", Journal of Vacuum Science Technology, vol. 20, no. 3, 1982, pp. 355
4. Finegan, J.D. and Hoffman, R.W., "Stress and Stress Anisotropy in Evaporated Iron Films", Journal of Applied Physics, vol. 30, 1959, pp.597
5. Hoffman, R.W., "The Mechanical Properties of Nonmetallic Thin Films", in Physics of Non-Metallic Thin Films, NATO Advanced Study Institute Series, Edited by C.H. Dupuy and A. Cachard, Vol. B-14, Plenum, New York, 1976, pp. 273
6. D'Heurle, F.M., "Aluminum Films Deposited by RF Sputtering" Metallurgy Transaction, vol. 1, 1970, pp. 725
7. st Electronic Components and Technology Conference, Orlando, FL, 2001, pp. 671.
8. JESD22-A104-B, "JEDEC Standard - Temperature Cycling", JEDEC Solid State Technology Association, Electronic Industries Alliance, July, 2000
9. th Electronic Components and Technology Conference, 1999, pp. 111
10. Material property data, http://www.matweb.com
11. CINDAS Micrelectronics Packaging Materials Database (version 2.21), Center of Information and Numerical Data Analysis and Synthesis, Purdue Univeristy, 1999
12. Antler, M., "Sliding Wear of Metallic Contacts", IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. CHMT-4, no. 1, pp. 15, 1981
13. Begley, M.R. and Hutchinson, J.W., "Plasticity in Fretting of Coated Substrates", Engineering Fracture Mechanics vol. 62, pp. 145, 1999
14. Suresh, S., "Fatigue of Materials", Second Edition, Cambridge University Press, U.K., ISBN 0-521-57847-7, 2001
15. Archard, J.F., "Contact and Rubbing of Flat Surfaces", Journal of Applied Physics, vol. 24, no. 8, pp. 981, 1953
16. Rabinowicz, E., "The Least Wear", Wear, vol. 100, pp. 533, 1984
17. Kragelsky, I.V., "Friction and Wear", Butterworths, London, 1965
18. Challen, J.M., Oxley, P.L.B. and Hockenhull, B.S., "Prediction of Archard's Wear Coefficient for Metallic Sliding Friction Assuming A Low Cycle Fatigue Wear Mechanism", Wear, vol. 111, pp.275, 1986
19. Pang, J.H.L. and Tan, C.K., "Thermal Analysis of a Wire Bond Chip-On-Board Package", ITherm'98, The Sixth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 481, 1998
20. Torrance, A.A. and Buckley, T.R., "A Slip-line Field Model of Abrasive Wear", Wear, vol.196, pp. 35, 1996
21. Tian, H., Saka, N. and Rabinowicz, E., "Friction and Failure of Electroplated Sliding Contacts", Wear, vol. 142, pp. 57, 1991