Thermal analysis of a wirebond chip-on-board package

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn , Issue , 1998, Pages 481-487

  Pang, John H L ^a   Tan, Chee Keong ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTRIC WIRE; FINITE ELEMENT METHOD; HEAT CONVECTION; HEAT TRANSFER; MATHEMATICAL MODELS; MULTICHIP MODULES; NATURAL CONVECTION; THERMAL CYCLING; THERMAL STRESS; THERMOANALYSIS; WIND TUNNELS;

THERMAL CALIBRATION; THERMAL MEASUREMENT; THERMOMECHANICAL STRESS ANALYSIS; WIRE BOND CHIP ON BOARD PACKAGING;

ELECTRONICS PACKAGING;

EID: 0031620349     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)