Design data for hot-via interconnects in chip scale packaged MMICs up to 110 GHz

Conference Proceedings- European Microwave Conference

Volumn 1, Issue , 2004, Pages 97-100

  Bessemoulin, Alexandre ^a  

^a United Monolithic Semiconductors GmbH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

AMPLIFIERS (ELECTRONIC); CHIP SCALE PACKAGES; COATINGS; ELECTROMAGNETISM; HIGH ELECTRON MOBILITY TRANSISTORS; METALLIZING; OPTICAL INTERCONNECTS; SIGNAL PROCESSING;

BROADBAND SIGNALS; BUMP INTERCONNECTS; PHEMT AMPLIFIERS; RF SIGNAL;

MONOLITHIC MICROWAVE INTEGRATED CIRCUITS;

EID: 18744389498     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

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