Elastoplastic analysis of W-Cu functionally graded materials subjected to a thermal shock by micromechanical model

Journal of Thermal Stresses

Volumn 24, Issue 7, 2001, Pages 631-649

  Ueda, Sei ^a  

^a OSAKA INSTITUTE OF TECHNOLOGY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 1842789169     PISSN: 01495739     EISSN: None     Source Type: Journal    
DOI: 10.1080/014957301300194814     Document Type: Article

References (13)

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8. K. Kokini and B. D. Choules, Surface Thermal Fracture of Functionally Graded Ceramic Coatings: Effect of Architecture and Materials, Composites Engrg., vol. 5, pp. 865-877, 1995.
9. M. M. Gasik and K. R. Lilius, Evaluation of Properties of W-Cu Functional Gradient Materials by Micromechanicai Model, Comp. Mat. Sci , vol. 3, pp. 41-49, 1994.
10. S. Ueda and M.M. Gasik, Thermal-elasto-plastic Analysis of W-Cu Functionally Graded Materials Subjected to a Uniform Heat Flow by Micromechanical Model, J. Thermal Stresses, vol. 23, pp. 395-409, 2000.
11. J. Gittus, Creep, Viscoelasticity and Creep Fracture in Solids, p. 606, Applied Science Publishers, London, 1976.
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