Measurement of residual stresses in flip chip underfill resins

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics: Incoperating POLY, PEP and Adhasives in Electronics

Volumn , Issue , 2001, Pages 160-167

  Sham, Man Lung ^a   Kim, Jang Kyo ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

Coefficient of thermal expansion; Flip chip package; Residual stresses; Thermo mechanical analysis

Indexed keywords

CURING; ELECTRONICS PACKAGING; RESIDUAL STRESSES; RESINS; RHEOLOGY; THERMAL STRESS; THERMOMECHANICAL TREATMENT;

PORTABLE ELECTRONICS;

FLIP CHIP DEVICES;

EID: 0035791294     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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