Nanoparticulate and interfacial mechanics in confined geometries typical of chemical-mechanical planarization

American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD

Volumn 374, Issue 3, 2003, Pages 199-206

  Ng, S H ^c   Zettner, C M ^c   Zhou, C ^c   Yoon, I H ^a   Danyluk, S ^c   Sacks, M ^b   Yoda, M ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b Georgia Institute of Technology   (United States)

^c NONE

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITION; DIELECTRIC MATERIALS; FLUORESCENCE; GLASS; INDUSTRIAL ECONOMICS; INTERFACES (MATERIALS); PARTICLE SIZE ANALYSIS; POLISHING; POLYSTYRENES; SILICA; SILICON WAFERS; TRANSMISSION ELECTRON MICROSCOPY; WEAR OF MATERIALS;

CHEMICAL MECHANICAL PLANARIZATION (CMP); INTERFACIAL MECHANICS; MATERIAL REMOVAL RATE (MRR);

NANOSTRUCTURED MATERIALS;

EID: 1842533994     PISSN: 02725673     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2003-41964     Document Type: Conference Paper

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