Back Side Damage Gettering of Cu Using a Cavitating Jet

Electrochemical and Solid-State Letters

Volumn 7, Issue 4, 2004, Pages

  Kumano, H ^a   Soyama, H ^a  

^a TOHOKU UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BUBBLE FORMATION; CONTAMINATION; COPPER; CRYSTAL GROWTH FROM MELT; DIFFUSION; ELASTIC MODULI; ETCHING; GETTERS; HEAT TREATMENT; PRESSURE EFFECTS; SILICON WAFERS;

CAVITATING JET; ETCH PITS;

JETS;

EID: 1842531652     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1648614     Document Type: Article

References (4)

1. M. C. Chen and V. J. Silvestri, J. Electrochem. Soc., 129, 1294 (1982).
2. D. Kropman, S. Dolgov, and T. Kaerner, Diffus. Defect Data, Pt. A, 143-147, 1027 (1997).
3. G. E. J. Eggermont, R. J. Falster, and S. K. Hahn, Solid State Technol., 26, 171 (1983).
4. H. Soyama and H. Kumano, Electrochem. Solid-State Lett., 3, 93 (2000).