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Volumn 174-175, Issue , 2003, Pages 303-309
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Characterization of WC-CrAlN heterostructures obtained using a cathodic arc ion plating process
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Author keywords
Buffer layer; Heterostructure; WC CrAlN
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Indexed keywords
ADHESION;
ELECTRON DIFFRACTION;
MICROHARDNESS;
NANOSTRUCTURED MATERIALS;
RESIDUAL STRESSES;
SEMICONDUCTING FILMS;
TRANSMISSION ELECTRON MICROSCOPY;
TUNGSTEN CARBIDE;
X RAY DIFFRACTION ANALYSIS;
NANO-LAYERED STRUCTURES;
HETEROJUNCTIONS;
COATING;
INDUSTRIAL APPLICATION;
PLASMA;
SURFACE PROPERTY;
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EID: 18344399594
PISSN: 02578972
EISSN: None
Source Type: Journal
DOI: 10.1016/S0257-8972(03)00352-9 Document Type: Article |
Times cited : (10)
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References (15)
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