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Volumn 196, Issue 1-3 SPEC. ISS., 2005, Pages 180-183
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Ionization fraction in sputter-based copper ion sources for plasma immersion ion implantation
a
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Author keywords
Copper ion source; Inductively coupled plasma; Ionization fraction; Sputtering
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Indexed keywords
COPPER;
ION IMPLANTATION;
MASS SPECTROMETRY;
POSITIVE IONS;
SILICON;
SPUTTER DEPOSITION;
THIN FILMS;
DISCHARGE PRESSURE;
IONIZATION FRACTION;
PLASMA IMMERSION ION IMPLANTATION (PIII);
QUADRAPOLE MASS SPECTROMETRY (QMS);
IONIZATION;
ELECTROCOATING;
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EID: 18144399582
PISSN: 02578972
EISSN: None
Source Type: Journal
DOI: 10.1016/j.surfcoat.2004.08.119 Document Type: Article |
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Times cited : (6)
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References (9)
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