-
1
-
-
0033503873
-
Ultra-thin tetrahedral amorphous carbon film as solider overcoat for high areal density magnetic recording
-
Han H, Ryan F, Mcclure M. Ultra-thin tetrahedral amorphous carbon film as solider overcoat for high areal density magnetic recording. Surface and Coatings Technology, 1999, 121: 579-584
-
(1999)
Surface and Coatings Technology
, vol.121
, pp. 579-584
-
-
Han, H.1
Ryan, F.2
Mcclure, M.3
-
2
-
-
0002551327
-
2 head media interface
-
Orlando, Florida
-
2, Orlando, Florida, 1999: 1-9
-
(1999)
2
, pp. 1-9
-
-
Menon, A.K.1
-
3
-
-
0033377792
-
Chemical, mechanical and tribological characterization of ultra-thin and hard amorphous carbon coatings as thin as 3.5 nm, recent development
-
Bhushan B. Chemical, mechanical and tribological characterization of ultra-thin and hard amorphous carbon coatings as thin as 3.5 nm, recent development. Diam. And Relat. Mater., 1999, 8: 1985-2015
-
(1999)
Diam. And Relat. Mater.
, vol.8
, pp. 1985-2015
-
-
Bhushan, B.1
-
5
-
-
0037375860
-
Uitra-low-flying-height design form the viewpoint of contact vibration
-
Xu J, Tsuchiyama R. Uitra-low-flying-height design form the viewpoint of contact vibration. Tribology International, 2003, 36: 459-466
-
(2003)
Tribology International
, vol.36
, pp. 459-466
-
-
Xu, J.1
Tsuchiyama, R.2
-
6
-
-
17244367642
-
IDEMA (International disk drive equipment and materials association)
-
Disk Drive Technology. IDEMA
-
IDEMA (International disk drive equipment and materials association). Disk Drive Technology. IDEMA, 2000: 7-9
-
(2000)
, pp. 7-9
-
-
-
7
-
-
17244367087
-
-
Chinese source
-
-
-
-
8
-
-
0003156497
-
Chemical-mechanical polishing of interlayer dielectric: A review
-
Ali I. Chemical-mechanical polishing of interlayer dielectric: a review. Solid State Technology, 1994, 34: 63-70
-
(1994)
Solid State Technology
, vol.34
, pp. 63-70
-
-
Ali, I.1
-
9
-
-
0346248263
-
Chemical-mechanical polishing: Process manufacturability
-
Rahul J, Janos F, Huang C K. Chemical-mechanical polishing: process manufacturability. Solid State Technology, 1994, 34: 71-75
-
(1994)
Solid State Technology
, vol.34
, pp. 71-75
-
-
Rahul, J.1
Janos, F.2
Huang, C.K.3
-
10
-
-
0022793142
-
Planarization techniques for multilevel matellization
-
Saxena A N, Pramanik D. Planarization techniques for multilevel matellization. Solid State Technol., 1986, 29: 95-100
-
(1986)
Solid State Technol.
, vol.29
, pp. 95-100
-
-
Saxena, A.N.1
Pramanik, D.2
-
11
-
-
17244379163
-
Abrasives composition, substrate and process for producing the same, and magnetic recording medium and process for producing the same
-
US Patent 5868604
-
Atsugi, Takeshi, Shibata. Abrasives composition, substrate and process for producing the same, and magnetic recording medium and process for producing the same. US Patent 5868604, 1999-02-09
-
(1999)
-
-
Atsugi1
Takeshi2
Shibata3
-
12
-
-
17244364181
-
Composition and method for polishing rigid disks
-
US Patent 6015506
-
Streinz, Christopher C, Neville. Composition and method for polishing rigid disks. US Patent 6015506, 2000-01-18
-
(2000)
-
-
Streinz1
Christopher, C.2
Neville3
-
13
-
-
17244366757
-
Polishing composition
-
US Patent 6454820
-
Hagihara, Toshiya, Naito. Polishing composition. US Patent 6454820, 2002-09-24
-
(2002)
-
-
Hagihara1
Toshiya2
Naito3
-
14
-
-
0001417013
-
The importance of particle size to the performance of abrasive particles in the CMP process
-
Michael C P, Duncan A G. The importance of particle size to the performance of abrasive particles in the CMP process. J. Electro. Mater., 1996, 25: 1612-1616
-
(1996)
J. Electro. Mater.
, vol.25
, pp. 1612-1616
-
-
Michael, C.P.1
Duncan, A.G.2
-
16
-
-
0037393374
-
Investigation on the final polishing slurry and technique of silicon substrate in ULSI
-
Liu Y, Zhang K, Wang F, et al. Investigation on the final polishing slurry and technique of silicon substrate in ULSI. Microelectronic Engineering, 2003, 66: 438-444
-
(2003)
Microelectronic Engineering
, vol.66
, pp. 438-444
-
-
Liu, Y.1
Zhang, K.2
Wang, F.3
-
17
-
-
0030381032
-
Effects of particle size, polishing pad and contact pressure in free abrasive polishing
-
Xie Y, Bhushan B. Effects of particle size, polishing pad and contact pressure in free abrasive polishing. Wear, 1996, 200: 281-295
-
(1996)
Wear
, vol.200
, pp. 281-295
-
-
Xie, Y.1
Bhushan, B.2
-
19
-
-
0032730568
-
Investigation of the kinetics of tungsten chemical polishing in potassium iodate-based slurries. I: Role of alumina and potassium iodate
-
Stein D J, Hetherington D L, Cecchi J L. Investigation of the kinetics of tungsten chemical polishing in potassium iodate-based slurries I: Role of alumina and potassium iodate. J. of the Electrochemical Society, 1999, 146: 376-381
-
(1999)
J. of the Electrochemical Society
, vol.146
, pp. 376-381
-
-
Stein, D.J.1
Hetherington, D.L.2
Cecchi, J.L.3
|