Behavioral models of pre-compensation driver and dynamic termination receiver for packaging system timing and coupled noise simulations

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn 2002-January, Issue , 2002, Pages 329-332

  Chen, Zhaoqing ^a   Katopis, George ^a   Becker, Wiren Dale ^a  

^a IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING;

BEHAVIORAL MODEL; DYNAMIC TERMINATION; NOISE SIMULATION; PACKAGING SYSTEM; PRE-COMPENSATION; VOLTAGE CONTROLLED RESISTORS; VOLTAGE CONTROLLED SWITCHES;

BEHAVIORAL RESEARCH;

EID: 15944364029     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPEP.2002.1057943     Document Type: Conference Paper

References (5)

1. S.Stievano and I.A.Maio, "Behavioral models of digital IC ports from measured transient waveforms," in Proc. IEEE 9th Topicul Meet. Elect. Performance Electron. Packag., Sconsdale, AZ, Oct. 2000, pp.2 1 1-214.
2. I.S.Stievano, Z.Chen, D.Becker, F.G.Canavero, G.Katopis, and I.A.Maio, "Behavioral modeling of digital IC input and output ports," in Proc. IEEE 10th Topical Meet. Elect. Peifonnance Electron. Packag., Cambridge, MA, Oct. 2001, pp.33 1-334.
3. Z.Chen, W.D.Becker, and G.Katopis, "A fast simulation method for single and coupled lossy lines with frequency-dependent parameters based on triangle impulse responses," in Proc. IEEE 8th Topical Meet. Elect. Perfomance Electron. Packag., San Diego, CA, Oct. 1999, pp.257-260.
4. Z.Chen, "Driver and receiver one-port approximate models for system timing and coupled noise simulation," in Proc. IEEE 9th Topical Meet. Elect. Perfomance Electron. Packag., Sconsdale, AZ, Oct. 2000, pp. 199-202.
5. Z.Chen and A.Ruehli, 'Time-domain scattering method using triangle impulse responses for modeling electronic packaging components," in Proc. IEEE 10th Topical Meet. Elect. Performance Electron. Packag., Cambridge, MA, Oct. 2001, pp.51-54.