Time-domain scattering method using triangle impulse responses for modeling electronic packaging components

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn , Issue , 2001, Pages 51-54

  Chen, Zhaoqing ^a   Ruehli, Albert ^a  

^a IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; CONVOLUTION; MATHEMATICAL MODELS; SCATTERING PARAMETERS; TIME DOMAIN ANALYSIS;

TIME DOMAIN SCATTERING METHOD; TRIANGLE IMPULSE RESPONSES;

ELECTRONICS PACKAGING;

EID: 0035699605     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. Transient simulation of arbitrary nonuniform interconnection structures characterized by scattering parameters
2. S-domain methods for simultaneous time and frequency characterization of electromagnetic devices
3. Simulation of single and coupled transmission lines using time-domain scattering parameters
4. A fast simulation method for single and coupled lossy lines with frequency-dependent parameters based on triangle impulse responses
5. Solution of a complex via-pin connector problem using the partial element equivalent circuit(PEEC) method
6. A new approach to signal integrity analysis of high-speed packaging