Sintering behavior and interfacial analysis of Ni/Cu electrode with BaTiO3 particulates

Journal of Electroceramics

Volumn 14, Issue 1, 2005, Pages 25-36

  Chen, Chih Lung ^a   Lee, Wen Hsi ^b   Wei, Wen Cheng ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

^b Phycomp Taiwan Ltd   (Taiwan)

Author keywords

BaTiO3; Cu; Electrode; Interfacial reaction; Ni

Indexed keywords

BARIUM COMPOUNDS; CERAMIC MATERIALS; CONCENTRATION (PROCESS); HIGH RESOLUTION ELECTRON MICROSCOPY; MICROSTRUCTURE; NICKEL ALLOYS; PERMITTIVITY; SCANNING ELECTRON MICROSCOPY; SINTERING; SURFACE CHEMISTRY; THERMAL EXPANSION; THERMOANALYSIS; TRANSMISSION ELECTRON MICROSCOPY;

BASE METAL ELECTRODE (BME); INTERFACIAL DIFFUSION; INTERFACIAL REACTIONS; MULTILAYER CERAMIC CAPACITORS (MLCC);

ELECTRODES;

EID: 15544371956     PISSN: 13853449     EISSN: None     Source Type: Journal    
DOI: 10.1007/s10832-005-6581-5     Document Type: Article

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