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Volumn , Issue , 2002, Pages 18-19

Advanced Cu/low-k (k = 2.2) multilevel interconnect for 0.10/0.07 μm generation

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITANCE; COPPER; DIELECTRIC MATERIALS; ETCHING; FRICTION; LEAKAGE CURRENTS; PHOTORESISTS; POLISHING;

EID: 0036045161     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (8)

References (5)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.