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Volumn , Issue , 2002, Pages 18-19
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Advanced Cu/low-k (k = 2.2) multilevel interconnect for 0.10/0.07 μm generation
a a a a a a a a a a |
Author keywords
[No Author keywords available]
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Indexed keywords
CAPACITANCE;
COPPER;
DIELECTRIC MATERIALS;
ETCHING;
FRICTION;
LEAKAGE CURRENTS;
PHOTORESISTS;
POLISHING;
MULTILEVEL INTERCONNECTS;
INTERCONNECTION NETWORKS;
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EID: 0036045161
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (8)
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References (5)
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