Thermal boundary resistance of mechanical contacts between solids at sub-ambient temperatures

Journal of Physics D: Applied Physics

Volumn 32, Issue 6, 1999, Pages

  Gmelin, E ^a   Asen Palmer, M ^a   Reuther, M ^a   Villar, R ^b  

^a MAX PLANCK INSTITUT FÜR FESTKÖRPERFORSCHUNG   (Germany)

^b UNIVERSIDAD AUTÓNOMA DE MADRID   (Spain)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; HEAT TRANSFER; INTERFACES (MATERIALS); NUMERICAL METHODS; PHONONS; SOLIDS; STAINLESS STEEL; SURFACES; THERMAL CONDUCTIVITY OF SOLIDS; THERMAL EFFECTS;

CRYOGENIC BONDING AGENTS; MECHANICALLY CONNECTED CONTACTS; THERMAL BOUNDARY RESISTANCE;

HEAT RESISTANCE;

EID: 0033100869     PISSN: 00223727     EISSN: None     Source Type: Journal    
DOI: 10.1088/0022-3727/32/6/004     Document Type: Article

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