Zinc bonding for MEMS packaging at the wafer-level

ASME International Mechanical Engineering Congress and Exposition, Proceedings

Volumn 2, Issue , 2001, Pages 3279-3282

  Lee, Ki Bang ^a   Lin, Liwei ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOND STRENGTH (MATERIALS); ELECTRIC INSULATION; ELECTROPLATING; FRACTURE TOUGHNESS; INTEGRATED CIRCUITS; MICROMACHINING; PACKAGING; ZINC;

BONDED WAFERS; PACKAGING TECHNOLOGY;

MICROELECTROMECHANICAL DEVICES;

EID: 1542411449     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (15)

1. L.-S. Fan, Y.-C. Tai and R.S. Muller, "IC-Processed Electrostatic Micromotors," Proc. IEDM, San Francisco, CA, U.S.A., 1988, pp.666-669.
2. W.C. Tang, T.-C H. Nguyen and R. T. Howe, "Laterally Driven Polysilicon Resonant Microstructures," Sensors and Actuators, Vol.A20, 1989, pp.25-32.
3. K.E. Perterson, "Silicon as a Mechanical Material," Proc. IEEE, vol. 70, May 1982, pp. 420-457.
4. R.R. Tummala and E. J. Rymaszewski, Eds., Microelectronics Packaging Handbook, New York: Van Nostrand Reinhold, 1989.
5. C.A. Harper, Electronic Packaging and Interconnection Hand Book, C. A. Harper, Ed. New York: McGraw-Hill, 1991.
6. T.A. Core, W.K. Tsang, and S. Sherman, "Fabrication Technology for an Integrated Surface-Micromachined Sensor," Solid State Technol., Oct. 1993, pp39-47.
7. D. Koester, R. Majedevan, A. Shishkoff, and K. Marcus, Multi-User MEMS Process (MUMPS) Introduction and Design Rules, Rev. 4, Research Triangle Park, NC: MCNC MEMS Technology Applications Center, July 1996.
8. D. Hicks, S.-C. Chang, M. W. Putty, and D. S. Eddy, "Piezoelectrically Activated Resonant Bridge Microaccelerometer," in Proc. 1994 Solid-State Sensors Actuators Workship, 1994, pp. 225-228.
9. M. Putty and K. Najafi, "A Micromachined Gyroscope," Proc. 1994 Solid-State Sensors and Actuators Workshop, 1994, pp.212-220.
10. J. Lasky, "Wafer Bonding for Silicon-on-Insulator Technologies," Appl. Phys. Lett., vol, 48, no. 1, 1986, pp. 78-80.
11. M. Shimbo, K. Furukawa, K. Fukuda, and K. Tanzawa, "Silicon-to-Silicon Direct Bonding Method," J. Appl. Phys., vol. 60, 1986, pp. 2987-2989.
12. L. Bowman and J. Meindl, "The packaging of implantable integrated sensors," IEEE Trans. Biomed. Eng., vol, BME-33, 1986, pp. 248-255.
13. Y. Lee and K. Wise, "A Batch-fabricated silicon Capacitive Pressure Transducer with Low Temperature Sensitivity," IEEE Trans. Electron Devices, vol. ED-29, 1982, pp.42-48.
14. Y.T. Cheng, W.T. Hsu, L. Lin, C.T. Nguyen, and K. Najafi, "Vacuum Packaging Technology using Localized Aluminum/Silicon-to-Glass Bonding," Proc. MEMS Conf., 2001, pp. 18-21.
15. Y.-C. Su and L. Lin, "Localized Plastic Bonding for Micro Assembly, Packaging and Liquid Encapsulation," Proc. MEMS Conf., 2001, pp. 50-53.